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S912ZVCA19F0MLFR

NXP Semiconductors

S912ZVCA19F0MLFR by NXP Semiconductors

The NXP S912ZVCA19F0MLFR microcontroller features a 16-bit CPU with 196608 ROM words and 2K data EEPROM size. It operates at up to 20 MHz, has 10-Ch 12-Bit ADC channels, and supports CAN, I2C, SPI connectivity. Ideal for automotive applications requiring low power consumption and high-speed processing capabilities.

Median Price

$5.521

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,000 parts In-Stock

1+ parts

$10.540

100+ parts

$6.750

1k+ parts

$5.690

10k+ parts

$5.620

2,000

$10.540

$6.750

$5.690

$5.620

EBV Elektronik

Germany . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$4.690

1k+ parts

$4.200

10k+ parts

$3.950

6,000

-

$4.690

$4.200

$3.950

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$5.862

1k+ parts

$5.250

10k+ parts

$4.938

6,000

-

$5.862

$5.250

$4.938

DigiKey

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$5.180

1k+ parts

-

10k+ parts

-

2,000

-

$5.180

-

-

Flip Electronics (Authorized)

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 216 parts In-Stock

1+ parts

$5.111

100+ parts

-

1k+ parts

-

10k+ parts

-

216

$5.111

-

-

-

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$6.910

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$6.910

-

-

-

TME

Poland . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$6.380

8,000

-

-

-

$6.380

Vyrian

USA . 4,561 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,561

-

-

-

-

Chip Stock

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,000

-

-

-

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Flip Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Anansix

USA . 295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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295

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,422 parts In-Stock

1+ parts

$4.570

100+ parts

-

1k+ parts

-

10k+ parts

-

4,422

$4.570

-

-

-

Semicontronic

India . 4,362 parts In-Stock

1+ parts

$4.570

100+ parts

$4.456

1k+ parts

$4.433

10k+ parts

-

4,362

$4.570

$4.456

$4.433

-

Corphita

USA . 3,662 parts In-Stock

1+ parts

$4.842

100+ parts

-

1k+ parts

-

10k+ parts

-

3,662

$4.842

-

-

-

Continental Prestige Electronics

USA . 4,144 parts In-Stock

1+ parts

$6.910

100+ parts

-

1k+ parts

-

10k+ parts

$6.772

4,144

$6.910

-

-

$6.772

Netroflash

USA . 500 parts In-Stock

1+ parts

$6.910

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$6.910

-

-

-

Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$8.420

100+ parts

-

1k+ parts

-

10k+ parts

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2,500

$8.420

-

-

-

Microchip USA

USA . 4,198 parts In-Stock

1+ parts

$17.030

100+ parts

$16.790

1k+ parts

$16.670

10k+ parts

$16.550

4,198

$17.030

$16.790

$16.670

$16.550

Advanced Electronics

New Zealand . 98 parts In-Stock

1+ parts

$69.263

100+ parts

$65.800

1k+ parts

$65.800

10k+ parts

-

98

$69.263

$65.800

$65.800

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UNI Independent Distributors

Spain . 6,845 parts In-Stock

1+ parts

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100+ parts

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6,845

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Argo Parts USA

USA . 1,870 parts In-Stock

1+ parts

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100+ parts

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1,870

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Lixinc

USA . 875 parts In-Stock

1+ parts

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875

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Overview

Experience the pinnacle of performance with the S912ZVCA19F0MLFR microcontroller by NXP Semiconductors. Crafted with precision and expertise, this versatile device offers unparalleled reliability and efficiency for a wide range of applications. Unlock endless possibilities with its advanced features and cutting-edge technology, providing value and benefits that exceed expectations. Elevate your projects with the quality and innovation that only NXP Semiconductors can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount design allows for easy and secure installation on a PCB, saving space and simplifying assembly processes.

Maximum Supply Voltage: 40 V

The high maximum supply voltage allows for flexibility in power source selection, making the microcontroller suitable for a wide range of applications.

On Chip Data RAM Width: 8

The 8-bit data RAM width enables efficient data processing and storage, enhancing the performance of the microcontroller.

Package Shape: SQUARE

The square package shape is space-efficient and easy to handle during assembly, contributing to overall design simplicity.

Bit Size: 16

The 16-bit architecture provides higher processing capabilities and precision, making the microcontroller suitable for demanding tasks.

DAC Channels: YES

The presence of DAC channels allows for analog signal generation, enabling the microcontroller to interact with the physical world.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for interfacing with external devices and peripherals, enhancing the microcontroller's versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style ensures easy integration into compact designs while minimizing signal interference.

Minimum Supply Voltage: 3.5 V

The low minimum supply voltage requirement makes the microcontroller energy-efficient and suitable for battery-powered applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range allows the microcontroller to function reliably in industrial and automotive environments.

CPU Family: S12Z

Being part of the S12Z CPU family ensures compatibility with existing hardware and software ecosystems, streamlining development processes.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range enables the microcontroller to operate in harsh cold conditions without performance degradation.

ADC Channels: YES

The inclusion of ADC channels enables the microcontroller to convert analog signals to digital data, expanding its sensing and monitoring capabilities.

Terminal Position: QUAD

The quad terminal position offers a compact and standardized layout for easy PCB design and efficient signal routing.

ROM Words: 196608

With a large ROM capacity of 196608 words, the microcontroller can store and execute complex programs without running out of memory.

Maximum Seated Height: 1.6 mm

The low maximum seated height ensures compatibility with slim-profile designs and reduces the overall footprint of the microcontroller in the system.

Digital To Analog Convertors: 1-Ch 8-Bit

The 8-bit digital-to-analog converter provides precise control over analog outputs, facilitating signal generation and interface compatibility.

Width: 7 mm

The 7 mm width enables a compact form factor, making the microcontroller suitable for space-constrained applications.

Data EEPROM Size: 2K

The 2K data EEPROM size allows for non-volatile data storage, retaining critical information even when power is disconnected.

Peripherals: COMPARATOR(2), POR, RTI, TIMER(8), WDT

The inclusion of multiple peripherals such as comparators, timers, and watchdog timers enhances the microcontroller's functionality for various applications.

Maximum Clock Frequency: 20 MHz

The 20 MHz clock frequency provides fast execution speeds for the microcontroller, enabling quick response times in real-time systems.

Length: 7 mm

The 7 mm length complements the compact width of the microcontroller, allowing for a space-efficient and symmetrical design layout.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates processing, memory, and I/O functions on a single chip, simplifying system design and reducing component count.

No. of Timers: 2

Having 2 timers enables the microcontroller to handle time-sensitive tasks and schedule events accurately, enhancing system performance.

RAM Bytes: 12288

The 12288 bytes of RAM provide ample memory for data storage and processing, supporting multitasking and complex algorithms.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and ensures secure PCB mounting, enhancing the overall robustness of the microcontroller connection.

Analog To Digital Convertors: 10-Ch 12-Bit

The 12-bit analog-to-digital converter with 10 channels provides high-resolution sensing capabilities, making the microcontroller suitable for precise data acquisition.

Maximum Supply Current: 35 mA

The low maximum supply current requirement reduces power consumption and heat generation, improving the overall efficiency of the microcontroller.

Nominal Supply Voltage: 12 V

The 12 V nominal supply voltage offers a standard power source option, ensuring compatibility with common power systems for easy integration.

No. of Serial I/Os: 3

Having 3 serial I/Os allows the microcontroller to communicate with multiple external devices simultaneously, enabling versatile connectivity options.

PWM Channels: YES

The presence of PWM channels enables the microcontroller to generate precise analog voltage levels, facilitating motor control and signal modulation.

Connectivity: CAN, I2C, SCI(2), SENT, SPI

Support for various communication protocols such as CAN, I2C, and SPI enhances the microcontroller's connectivity options with external devices and networks.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and fast reprogramming of the microcontroller, enabling firmware updates and customization for different applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm simplifies PCB layout and routing, allowing for high-density interconnections while maintaining signal integrity.

Format: FIXED POINT

The fixed-point format simplifies mathematical operations and data processing tasks, enhancing the efficiency and accuracy of the microcontroller computations.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates a moderate level of moisture sensitivity, ensuring proper handling and storage procedures for the microcontroller to maintain reliability.

Speed: 32 rpm

The 32 rpm speed rating highlights the microcontroller's ability to process instructions and perform tasks at a consistent and reliable pace, meeting system timing requirements.

Low Power Mode: YES

The low power mode capability allows the microcontroller to reduce energy consumption during idle or low-demand periods, extending battery life in portable devices.

On Chip Program ROM Width: 8

The 8-bit program ROM width enables efficient instruction fetching and execution, improving the overall performance and responsiveness of the microcontroller.

No. of I/O Lines: 30

Having 30 I/O lines provides ample interface options for connecting sensors, actuators, and peripherals, allowing the microcontroller to interact with its environment effectively.

Technical Specifications

Microcontrollers S912ZVCA19F0MLFR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

S12Z

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Serial I/Os:

3

No. of Terminals:

48

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

12288

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Current:

35 mA

Maximum Supply Voltage:

40 V

Minimum Supply Voltage:

3.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN, I2C, SCI(2), SENT, SPI

Peripherals:

COMPARATOR(2), POR, RTI, TIMER(8), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

S912ZVCA19F0MLFR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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