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S9S12VR16F0MLC

NXP Semiconductors

S9S12VR16F0MLC by NXP Semiconductors

MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE;

Median Price

$2.750

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.929

10,000

-

-

-

$2.929

Flip Electronics (Authorized)

USA . 5,000 parts In-Stock

1+ parts

-

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5,000

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Rochester

USA . 1,359 parts In-Stock

1+ parts

-

100+ parts

$2.570

1k+ parts

$2.300

10k+ parts

$2.160

1,359

-

$2.570

$2.300

$2.160

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 876 parts In-Stock

1+ parts

$3.182

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-

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876

$3.182

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Vyrian

USA . 7,170 parts In-Stock

1+ parts

-

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7,170

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Flip Electronics

USA . 5,000 parts In-Stock

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Anansix

USA . 729 parts In-Stock

1+ parts

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729

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,952 parts In-Stock

1+ parts

$3.015

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-

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3,952

$3.015

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Vigor

Singapore . 4,754 parts In-Stock

1+ parts

$4.427

100+ parts

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4,754

$4.427

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AZTECH Wire

Italy . 657 parts In-Stock

1+ parts

$9.000

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657

$9.000

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Microchip USA

USA . 3,500 parts In-Stock

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$20.345

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3,500

$20.345

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A-Z Elektronik GmbH

Germany . 465 parts In-Stock

1+ parts

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465

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UNI Independent Distributors

Spain . 437 parts In-Stock

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437

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Technical Specifications

Microcontrollers S9S12VR16F0MLC attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

HCS12

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

16

No. of Terminals:

32

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Current:

22 mA

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

128

Connectivity:

LIN, SCI

Peripherals:

COMPARATOR(3), POR, PWM(12), TIMER(4), WDT

Analog To Digital Convertors:

2-Ch 10-Bit

Trade Compliance

S9S12VR16F0MLC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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