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S9S12H128J1VFVER

NXP Semiconductors

S9S12H128J1VFVER by NXP Semiconductors

The NXP Semiconductors S9S12H128J1VFVER is a 16-bit microcontroller with a max clock frequency of 50 MHz. It features 8 timers, 16-channel ADC, and connectivity options like CAN, I2C, SCI, and SPI. This microcontroller is commonly used in applications requiring high-speed processing and extensive peripheral support.

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Digiode

USA . 3,636 parts In-Stock

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Anansix

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Vyrian

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Nova Conductors

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Semicontronic

India . 1,086 parts In-Stock

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$2.925

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Ampacity Inc.

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One Stop Electronics

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AZTECH Wire

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Vigor

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Aztec Data Supply Inc.

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Advanced Electronics

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Overview

Experience the next level of innovation with the S9S12H128J1VFVER microcontroller by NXP Semiconductors. As leaders in the industry, NXP ensures top-notch quality and reliability in every product they create. The S9S12H128J1VFVER offers unmatched value and benefits, making it the perfect choice for a wide range of applications. With its advanced features and high-performance capabilities, this microcontroller opens up endless possibilities for your projects. Say goodbye to limitations and hello to limitless potential with the S9S12H128J1VFVER by NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material provides durability and protection, making it suitable for various applications.

Surface Mount: YES

With surface mount capability, this microcontroller can easily be mounted onto printed circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5 V allows for compatibility with a wide range of power sources, offering flexibility in different operating conditions.

On Chip Data RAM Width: 8

With an on-chip data RAM width of 8, this microcontroller enables efficient data processing, enhancing overall performance and responsiveness.

Address Bus Width: 16

The 16-bit address bus width allows for access to a larger memory space, accommodating more data storage and enabling complex programs to be executed.

Package Shape: SQUARE

The square package shape makes it easier to fit this microcontroller into tight spaces, providing versatility and ease of integration in various designs.

Bit Size: 16

The 16-bit architecture of this microcontroller allows for higher precision calculations and processing, enhancing its suitability for demanding applications.

No. of Terminals: 144

With its ample 144 terminals, this microcontroller offers extensive connectivity options, enabling seamless interaction with external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style provides a sleek and compact form factor, making it ideal for space-constrained designs where size matters.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement of 4.5 V ensures compatibility with a wide range of power sources, allowing for versatile deployment in various environments.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures reliable performance even in demanding and extreme temperature conditions, enhancing the product's overall durability.

CPU Family: HCS12H

Belonging to the HCS12H CPU family, this microcontroller inherits proven reliability, advanced features, and extensive development support, making it a robust and trustworthy choice.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this microcontroller is suitable for deployment in both freezing cold and scorching hot environments, expanding its range of applications.

ADC Channels: YES

The inclusion of ADC channels allows this microcontroller to convert analog signals into digital data, broadening its capabilities and enabling precise measurement and control.

Terminal Position: QUAD

The quad terminal position facilitates easy and secure connections, ensuring reliable interfacing with external components or peripherals, simplifying the integration process.

ROM Words: 131072

With an impressive ROM word capacity of 131,072, this microcontroller can store extensive program code, accommodating complex algorithms and supporting feature-rich applications.

Maximum Seated Height: 1.6 mm

The slim form factor and maximum seated height of 1.6 mm make this microcontroller suitable for space-limited designs, enhancing its versatility and compatibility.

Width: 20 mm

With a width of 20 mm, this microcontroller can be easily integrated into various electronic systems and assemblies, offering flexibility in design layouts.

Data EEPROM Size: 2048

The generous data EEPROM size of 2048 allows for non-volatile storage of critical information, enabling data persistence and facilitating system customization.

External Data Bus Width: 16

The external data bus width of 16 enables high-speed data transfer between the microcontroller and external memory, enhancing overall system performance.

Peripherals: PWM(6), TIMER(8), WDT

This microcontroller comes equipped with 6 PWM channels, 8 timers, and WDT (watchdog timer), providing numerous options for precise timing control, pulse generation, and system monitoring.

Maximum Clock Frequency: 50 MHz

With a maximum clock frequency of 50 MHz, this microcontroller offers high-speed processing capabilities, enabling rapid execution of instructions and efficient system operation.

Maximum Time At Peak Reflow Temperature (s): 40

The microcontroller can withstand a peak reflow temperature for up to 40 seconds, making it suitable for soldering processes, ensuring reliable and robust solder joints.

Peak Reflow Temperature °C: 260

The ability to withstand a peak reflow temperature of 260°C ensures the microcontroller's reliability during soldering, guaranteeing good thermal and mechanical performance.

Length: 20 mm

With a length of 20 mm, this microcontroller can easily fit into compact designs, providing versatility and allowing for various form factors in product development.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, this product integrates various peripheral functionalities, enabling it to perform diverse control and processing tasks, making it a comprehensive solution.

No. of Timers: 8

With 8 timers available, this microcontroller offers precise and flexible timing options, allowing for efficient synchronization of tasks and optimal utilization of system resources.

RAM Bytes: 6144

The generous RAM capacity of 6144 bytes provides ample working memory for data storage and manipulation, enabling efficient operation of complex algorithms and applications.

Technology: CMOS

Utilizing CMOS (Complementary Metal-Oxide-Semiconductor) technology, this microcontroller offers low power consumption, reducing energy requirements and enhancing battery life in portable applications.

Terminal Form: GULL WING

The gull wing terminal form ensures secure and reliable electrical connections during assembly, offering ease of mounting and facilitating automated manufacturing processes.

Analog To Digital Converters: 16-Ch 10-Bit

With 16 analog-to-digital converters (ADCs) featuring a resolution of 10 bits, this microcontroller allows for precise and accurate conversion of analog signals into digital data, supporting advanced sensing and measurement applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage requirement of 5 V ensures compatibility with standard power sources, making this microcontroller accessible and widely applicable.

No. of Serial I/Os: 4

With 4 serial I/Os, this microcontroller facilitates communication with external devices or modules, enabling seamless integration with other components of the system.

PWM Channels: YES

The availability of PWM channels in this microcontroller enables precise control of pulse width modulation, making it suitable for applications such as motor control or LED brightness adjustment.

Connectivity: CAN(2), I2C, SCI(2), SPI

With connectivity options including 2 CAN interfaces, I2C, 2 SCI ports, and SPI, this microcontroller offers versatile data exchange capabilities, supporting various communication protocols and expanding compatibility.

ROM Programmability: FLASH

The ROM programmability using flash memory technology allows for easy and flexible firmware updates, ensuring scalability and adaptability to evolving application requirements.

Terminal Pitch: 0.5 mm

The narrow terminal pitch of 0.5 mm enables high-density interconnections, facilitating the miniaturization of electronic systems and offering greater design flexibility.

Format: FIXED POINT

The fixed-point format employed in this microcontroller enables efficient numerical calculations and high-performance signal processing, allowing for accurate and reliable data manipulation.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this microcontroller is suitable for a wide range of environments while maintaining its integrity and reliability, providing enhanced protection against moisture-related issues.

Speed: 25 rpm

Operating at a speed of 25 rpm, this microcontroller offers efficient performance for applications requiring specific rotational speed control.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 allows for storing and executing program code efficiently, ensuring smooth operation and enabling the microcontroller to handle complex tasks.

No. of I/O Lines: 117

With 117 I/O lines available, this microcontroller offers ample options for interfacing with external devices, enabling versatile connectivity and efficient data exchange.

Technical Specifications

Microcontrollers S9S12H128J1VFVER attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

16

Boundary Scan:

NO

CPU Family:

HCS12H

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

117

No. of Serial I/Os:

4

No. of Terminals:

144

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

6144

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

2048

Connectivity:

CAN(2), I2C, SCI(2), SPI

Peripherals:

PWM(6), TIMER(8), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

S9S12H128J1VFVER Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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