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S9S12GA192F0MLHR

NXP Semiconductors

S9S12GA192F0MLHR by NXP Semiconductors

NXP Semiconductors' S9S12GA192F0MLHR microcontroller features 16-bit CPU12, 196608 ROM words, and 11264 RAM bytes. Ideal for automotive applications with AEC-Q100 screening, it operates at -40 to 125 °C and offers 54 I/O lines for versatile connectivity.

Median Price

$7.096

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

S9S12GA192F0MLHR by NXP Semiconductors
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Avnet

USA . 18,000 parts In-Stock

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$7.253

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$7.253

Rochester

USA . 370 parts In-Stock

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$6.940

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$6.210

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$5.850

370

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$6.940

$6.210

$5.850

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Digiode

USA . 3,345 parts In-Stock

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$5.558

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$5.558

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Anansix

USA . 325 parts In-Stock

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325

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Nova Conductors

Japan . 81 parts In-Stock

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Vyrian

USA . 34 parts In-Stock

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One Stop Electronics

USA . 62 parts In-Stock

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$4.970

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$4.970

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Corphita

USA . 4,546 parts In-Stock

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$5.265

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Component Stockers USA

USA . 350 parts In-Stock

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$6.670

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$6.270

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$6.670

$6.270

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Ampacity Inc.

Singapore . 103 parts In-Stock

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$10.820

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Microchip USA

USA . 3,767 parts In-Stock

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$17.470

100+ parts

$17.220

1k+ parts

$17.100

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$16.970

3,767

$17.470

$17.220

$17.100

$16.970

Lixinc

USA . 15,627 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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Argo Parts USA

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Overview

Unleash the power of innovation with the S9S12GA192F0MLHR microcontroller by NXP Semiconductors. Designed with precision and reliability, this cutting-edge device offers a wide range of applications in the automotive industry and beyond. With a focus on quality and performance, NXP Semiconductors ensures that customers can trust in the value and benefits of this product. Experience seamless integration, enhanced functionality, and unparalleled advantages with the S9S12GA192F0MLHR microcontroller - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product a reliable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on circuit boards, making it a convenient option for compact designs.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, providing flexibility in different power supply configurations.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures high reliability and quality suitable for automotive applications, making this product a trusted choice for automotive electronics.

Package Shape: SQUARE

The square package shape allows for efficient use of board space, making it ideal for designs where space is limited.

Bit Size: 16

A 16-bit architecture offers higher performance and efficiency compared to lower bit sizes, making this microcontroller suitable for complex tasks.

Power Supplies (V): 3.3/5

This microcontroller supports multiple power supply options, providing compatibility with different systems and power requirements.

No. of Terminals: 64

With 64 terminals, this microcontroller offers versatility in connectivity options, making it suitable for diverse applications.

Package Style (Meter): FLATPACK

The flatpack package style allows for easy handling and installation, making this product user-friendly and convenient for assembly.

Minimum Supply Voltage: 3.13 V

The low minimum supply voltage requirement ensures efficient power consumption and compatibility with various power sources, enhancing the product's usability.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, making it a reliable choice for industrial applications.

CPU Family: CPU12

The CPU12 family offers advanced processing capabilities and features, making this microcontroller suitable for high-performance applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance in extreme cold conditions, making this product suitable for various environments.

Terminal Finish: TIN

The TIN terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability and durability of the product.

ADC Channels: YES

The presence of analog-to-digital converter channels allows for precise and accurate data conversion, making this microcontroller suitable for sensor applications.

Terminal Position: QUAD

The quad terminal position provides flexibility in connection options, allowing for versatile PCB layouts and design configurations.

ROM Words: 196608

With a large ROM capacity, this microcontroller can store a vast amount of program data, making it suitable for applications requiring extensive program memory.

Width: 10 mm

The compact width of 10mm saves space on the PCB, making this microcontroller ideal for designs with size constraints.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency enables fast processing and response times, making this microcontroller suitable for applications demanding high-speed operation.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature ensures proper soldering during assembly, enhancing the reliability and durability of the product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the product can withstand the soldering process without damage, ensuring manufacturing reliability.

Length: 10 mm

The compact length of 10mm saves space on the PCB, making this microcontroller suitable for designs with size constraints.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures the microcontroller can operate reliably in automotive environments, making it a suitable choice for automotive applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller provides all-in-one functionality for various applications, making this product versatile and cost-effective.

RAM Bytes: 11264

With a large RAM capacity, this microcontroller can handle and process a significant amount of data, making it suitable for memory-intensive applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable in different environments.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and connection, ensuring reliable and efficient assembly of the product.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage offers compatibility with standard power sources, making this microcontroller easy to integrate into existing systems.

PWM Channels: YES

The presence of pulse-width modulation channels allows for precise control of analog outputs, making this microcontroller suitable for applications requiring high-resolution control.

ROM Programmability: FLASH

The flash programmability of the ROM allows for easy and quick firmware updates, enhancing the flexibility and versatility of the product.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm enables high-density mounting, making this microcontroller suitable for compact and space-constrained designs.

Moisture Sensitivity Level (MSL): 3

With MSL 3, this microcontroller has moderate moisture sensitivity, ensuring proper handling and storage procedures to maintain product reliability.

Speed: 25 rpm

The high speed of 25 rpm ensures fast data processing and response times, making this microcontroller suitable for real-time applications.

No. of I/O Lines: 54

With 54 I/O lines, this microcontroller offers ample connectivity options, allowing for versatile input/output configurations to meet various application requirements.

Technical Specifications

Microcontrollers S9S12GA192F0MLHR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

CPU12

Maximum Clock Frequency:

16 MHz

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

54

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

11264

ROM Words:

196608

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Trade Compliance

S9S12GA192F0MLHR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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