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S9S12P128J0CFT

NXP Semiconductors

S9S12P128J0CFT by NXP Semiconductors

NXP Semiconductors S9S12P128J0CFT microcontroller features 16-bit CPU12, 131072 ROM words, and 6144 RAM bytes. Ideal for industrial applications with a temperature range of -40 to 85 °C, it offers ADC/DAC channels and PWM support. Operating at up to 16 MHz clock frequency, it has a compact square package with 48 terminals.

Median Price

$4.732

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

S9S12P128J0CFT by NXP Semiconductors
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Verical

USA . 9,100 parts In-Stock

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$5.043

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$5.043

Rochester

USA . 3,255 parts In-Stock

1+ parts

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$4.420

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$3.950

10k+ parts

$3.720

3,255

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$4.420

$3.950

$3.720

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Digiode

USA . 3,594 parts In-Stock

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$4.237

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Vyrian

USA . 2,909 parts In-Stock

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Flip Electronics

USA . 2,600 parts In-Stock

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Anansix

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Nova Conductors

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Semicontronic

India . 3,228 parts In-Stock

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$3.790

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$3.695

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$3.676

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3,228

$3.790

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$3.676

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One Stop Electronics

USA . 2,999 parts In-Stock

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$3.790

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$3.790

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Ampacity Inc.

Singapore . 2,885 parts In-Stock

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$3.790

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Corphita

USA . 4,060 parts In-Stock

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$4.014

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Corohmni

South Africa . 92 parts In-Stock

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$4.090

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QUARKTWIN TECHNOLOGY LTD

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Argo Parts USA

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Microchip USA

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CPlus Electronics

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Bastille Electronics

Australia . 1,581 parts In-Stock

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Overview

Unlock the power of versatile microcontrollers with the NXP Semiconductors S9S12P128J0CFT. With a focus on quality and reliability, NXP Semiconductors is a trusted manufacturer in the industry. This microcontroller offers a wide range of applications in various industries, providing value and benefits to customers looking for efficient solutions. From automotive to industrial automation, this product delivers unmatched performance and functionality, making it a top choice for your next project. Experience the advantages of cutting-edge technology with the S9S12P128J0CFT from NXP Semiconductors.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy mounting on PCBs, saving space and making it suitable for compact designs.

Maximum Supply Voltage: 5.5 V

Can handle higher supply voltages, providing flexibility in power supply options.

Screening Level: AEC-Q100

Meets automotive industry quality standards, ensuring reliability and durability for automotive applications.

Package Shape: SQUARE

Square shape makes it easier to handle and mount on PCBs, ensuring a secure fit.

Bit Size: 16

16-bit architecture allows for more complex processing and higher performance.

DAC Channels: YES

Includes DAC channels for analog output, expanding the range of applications it can be used in.

Power Supplies (V): 1.8,3.3/5

Supports multiple power supply options, offering compatibility with various systems.

No. of Terminals: 48

Provides ample connectivity options for interfacing with external components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

Variety of package styles offer different thermal performance and mounting options.

Minimum Supply Voltage: 3.13 V

Can operate at lower supply voltages, suitable for energy-efficient designs.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments, making it suitable for industrial applications.

CPU Family: CPU12

Part of a well-known CPU family with established performance and reliability.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold environments, expanding its range of applications.

Terminal Finish: TIN

Tin finish provides good corrosion resistance and solderability for reliable connections.

ADC Channels: YES

Includes ADC channels for analog input, enabling sensor interfacing and data acquisition.

Terminal Position: QUAD

Quad terminal position provides stability and ease of soldering during assembly.

ROM Words: 131072

Large ROM capacity allows for storing complex code and data for diverse applications.

Maximum Seated Height: 1.05 mm

Low profile design saves space and allows for compact product designs.

Width: 7 mm

Compact width allows for dense PCB layouts and space-saving designs.

External Data Bus Width: 16

16-bit external data bus allows for efficient data transfer and processing.

Maximum Clock Frequency: 16 MHz

High clock frequency enables fast processing speed for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 40

Allows for efficient soldering during assembly without damaging the component.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during manufacturing processes.

Length: 7 mm

Compact length allows for flexible PCB layout and space-saving designs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, ensuring durability in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Built-in peripherals make it a complete solution for control and automation applications.

RAM Bytes: 6144

Sufficient RAM capacity for data storage and manipulation in real-time applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, suitable for battery-powered devices.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and offers better solder joint reliability.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage simplifies power management and compatibility with existing systems.

PWM Channels: YES

Includes PWM channels for precise control of analog signals, suitable for motor control and audio applications.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware in the field.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on PCBs, saving space and allowing for compact designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures.

Speed: 1.05 rpm

Operates at a speed suitable for real-time control and processing tasks.

No. of I/O Lines: 32

Sufficient I/O lines for connecting to external devices and peripherals, providing versatility in application design.

Technical Specifications

Microcontrollers S9S12P128J0CFT attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

CPU12

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3/5

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.05 mm

Speed:

1.05 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

S9S12P128J0CFT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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