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S9S12ZVL32F0MLF

NXP Semiconductors

S9S12ZVL32F0MLF by NXP Semiconductors

NXP Semiconductors' S9S12ZVL32F0MLF microcontroller features 16-bit CPU, 32768 ROM words, and 1024 RAM bytes. Ideal for automotive applications with AEC-Q100 screening level, operating at -40 to 125 °C temperature range, and offering up to 20 MHz clock frequency.

Median Price

$4.155

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

S9S12ZVL32F0MLF by NXP Semiconductors
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DigiKey

USA . 2,500 parts In-Stock

1+ parts

$5.860

100+ parts

$3.756

1k+ parts

$3.467

10k+ parts

$3.283

2,500

$5.860

$3.756

$3.467

$3.283

Mouser Electronics

USA . 370 parts In-Stock

1+ parts

$5.860

100+ parts

$3.470

1k+ parts

$2.720

10k+ parts

$2.650

370

$5.860

$3.470

$2.720

$2.650

Verical

USA . 11,206 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.450

10k+ parts

$2.313

11,206

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-

$2.450

$2.313

Rochester

USA . 11,206 parts In-Stock

1+ parts

-

100+ parts

$2.190

1k+ parts

$1.960

10k+ parts

$1.850

11,206

-

$2.190

$1.960

$1.850

Flip Electronics (Authorized)

USA . 1,450 parts In-Stock

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1,450

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Digiode

USA . 1,963 parts In-Stock

1+ parts

$3.050

100+ parts

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$3.050

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Nova Conductors

Japan . 50 parts In-Stock

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$5.070

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50

$5.070

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Maritex

Poland . 2,500 parts In-Stock

1+ parts

$5.921

100+ parts

$2.905

1k+ parts

-

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2,500

$5.921

$2.905

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Chip Stock

USA . 10,540 parts In-Stock

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Vyrian

USA . 1,865 parts In-Stock

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Flip Electronics

USA . 1,450 parts In-Stock

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Anansix

USA . 959 parts In-Stock

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DigiKey Marketplace

USA . 200 parts In-Stock

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100+ parts

$7.480

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200

-

$7.480

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,053 parts In-Stock

1+ parts

$2.570

100+ parts

-

1k+ parts

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10k+ parts

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2,053

$2.570

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One Stop Electronics

USA . 1,806 parts In-Stock

1+ parts

$2.570

100+ parts

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1,806

$2.570

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Corphita

USA . 1,316 parts In-Stock

1+ parts

$2.889

100+ parts

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$2.889

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Vigor

Singapore . 3,000 parts In-Stock

1+ parts

$4.565

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$4.565

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Continental Prestige Electronics

USA . 1,251 parts In-Stock

1+ parts

$4.854

100+ parts

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$4.757

1,251

$4.854

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$4.757

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$4.969

100+ parts

-

1k+ parts

$4.770

10k+ parts

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1,000

$4.969

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$4.770

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Corohmni

South Africa . 196 parts In-Stock

1+ parts

$17.630

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196

$17.630

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Microchip USA

USA . 957 parts In-Stock

1+ parts

$20.720

100+ parts

$20.420

1k+ parts

$20.280

10k+ parts

$20.130

957

$20.720

$20.420

$20.280

$20.130

Aztec Data Supply Inc.

USA . 25 parts In-Stock

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$79.390

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$79.390

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Perfect Parts

USA . 12,600 parts In-Stock

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UNI Independent Distributors

Spain . 7,974 parts In-Stock

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Lixinc

USA . 7,953 parts In-Stock

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,943 parts In-Stock

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Overview

Experience the cutting-edge technology of the S9S12ZVL32F0MLF microcontroller by NXP Semiconductors. This high-quality product offers reliability and unmatched performance for a wide range of applications in the automotive industry. With its advanced features and innovative design, this microcontroller provides customers with seamless integration, reduced power consumption, and enhanced functionality. Trust NXP Semiconductors to deliver top-of-the-line solutions that exceed expectations. Unlock the potential of your projects with the S9S12ZVL32F0MLF!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for automotive applications

Surface Mount: YES

Efficient and space-saving packaging for easy assembly

Maximum Supply Voltage: 18 V

Can handle high voltage input for versatile applications

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and quality

Package Shape: SQUARE

Compact design for efficient board layout

Bit Size: 16

Offers sufficient processing power for a wide range of tasks

Power Supplies (V): 5.5/18

Supports a range of power supply voltages for flexibility in design

No. of Terminals: 48

Plenty of connectivity options for interfacing with other components

Package Style (Meter): FLATPACK

Slim profile for space-saving installation

Minimum Supply Voltage: 5.5 V

Can operate at low voltage levels to conserve power

Maximum Operating Temperature: 125 °C

Can withstand high temperatures for automotive environments

CPU Family: CPU12

Specifically designed for automotive applications with robust processing capabilities

Minimum Operating Temperature: -40 °C

Operates in extreme cold conditions without issue

Terminal Finish: TIN

Ensures reliable electrical connections for long-term use

ADC Channels: YES

Ability to interface with analog sensors for data acquisition

Terminal Position: QUAD

Easy to solder and mount on the PCB

ROM Words: 32768

Offers ample storage for program code and data

Width: 7 mm

Compact size for integration into tight spaces

Maximum Clock Frequency: 20 MHz

Fast processing speed for responsive performance

Maximum Time At Peak Reflow Temperature (s): 40

Resilient to reflow soldering processes for ease of manufacturing

Peak Reflow Temperature °C: 260

Withstands high temperatures during assembly

Length: 7 mm

Uniform dimensions for streamlined assembly

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliability and durability

Peripheral IC Type: MICROCONTROLLER

Integrates multiple functions into a single chip for efficient design

RAM Bytes: 1024

Sufficient memory for data storage and processing

Technology: CMOS

Low power consumption and high noise immunity

Terminal Form: GULL WING

Easy to solder and mount on the PCB

Maximum Supply Current: 26 mA

Efficient power usage for extended battery life

Nominal Supply Voltage: 12 V

Standard voltage level for compatibility with common power sources

PWM Channels: YES

Ability to generate pulse-width modulation signals for precise control

ROM Programmability: FLASH

Easily reprogrammable for flexibility in firmware updates

Terminal Pitch: 0.5 mm

Fine pitch for high-density PCB designs

Moisture Sensitivity Level (MSL): 3

Suitable for automotive environments with potential exposure to moisture

Speed: 32 rpm

Efficient processing speed for real-time applications

No. of I/O Lines: 34

Plenty of input/output options for connecting external devices

Technical Specifications

Microcontrollers S9S12ZVL32F0MLF attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

CPU12

Maximum Clock Frequency:

20 MHz

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

34

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

5.5/18

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

26 mA

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

S9S12ZVL32F0MLF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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