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LS2088ASN7V1B

NXP Semiconductors

LS2088ASN7V1B by NXP Semiconductors

MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Peak Reflow Temperature (C): 250;

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

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Vyrian

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Digiode

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USA . 3,324 parts In-Stock

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Anansix

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Nova Conductors

Japan . 10 parts In-Stock

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AZTECH Wire

Italy . 43 parts In-Stock

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Semicontronic

India . 105 parts In-Stock

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Modulus Dynamics

Lithuania . 3,293 parts In-Stock

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Corohmni

South Africa . 150 parts In-Stock

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Microchip USA

USA . 2,106 parts In-Stock

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Vigor

Singapore . 3,000 parts In-Stock

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Argo Parts USA

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UNI Independent Distributors

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Corphita

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Continental Prestige Electronics

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Aranea Global

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Technical Specifications

Microcontrollers LS2088ASN7V1B attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

250

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

LS2088ASN7V1B Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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