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S912ZVL96F0MLF

NXP Semiconductors

S912ZVL96F0MLF by NXP Semiconductors

NXP Semiconductors S912ZVL96F0MLF microcontroller features 16-bit CPU, 8KB RAM, and 20MHz clock frequency. Ideal for automotive applications with CAN, I2C, and SPI connectivity options. Operating temperature range from -40 to 125°C makes it suitable for harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,372 parts In-Stock

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Anansix

USA . 1,714 parts In-Stock

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Digiode

USA . 1,293 parts In-Stock

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Nova Conductors

Japan . 37 parts In-Stock

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One Stop Electronics

USA . 1,061 parts In-Stock

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$2.000

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$2.000

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AZTECH Wire

Italy . 245 parts In-Stock

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$5.571

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Vigor

Singapore . 2,983 parts In-Stock

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$6.050

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Corohmni

South Africa . 13 parts In-Stock

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Semicontronic

India . 1,590 parts In-Stock

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$7.000

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$6.825

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$6.790

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Microchip USA

USA . 3,764 parts In-Stock

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$32.413

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Ampacity Inc.

Singapore . 709 parts In-Stock

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$35.000

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Aztec Data Supply Inc.

USA . 86 parts In-Stock

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$54.660

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Lixinc

USA . 13,999 parts In-Stock

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UNI Independent Distributors

Spain . 8,284 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

USA . 3,622 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 1,809 parts In-Stock

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Continental Prestige Electronics

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Overview

Discover the cutting-edge S912ZVL96F0MLF microcontroller by NXP Semiconductors, a powerhouse in automotive technology. With high-quality manufacturing and a wide range of applications, this microcontroller offers unparalleled value to customers. From its low power mode to its extensive connectivity options, including CAN, I2C, SCI, and SPI, this product provides efficient performance for a variety of projects. Trust NXP Semiconductors to deliver top-notch quality and innovation with the S912ZVL96F0MLF microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it reliable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and improving overall product design.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for versatility in power supply options, accommodating different system requirements.

ADC Channels: YES

Having ADC channels enables the microcontroller to interface with analog sensors and signals, expanding its functionality.

ROM Programmability: FLASH

Flash ROM programming allows for easy and flexible firmware updates, enhancing the product's adaptability to new requirements.

Connectivity: CAN, I2C, SCI(2), SPI

Multiple connectivity options facilitate communication with other devices and systems, enabling seamless integration in various applications.

No. of Timers: 2

Having multiple timers enables precise timing control and event management, essential for many applications requiring synchronization.

Speed: 32 rpm

The moderate speed capability makes this microcontroller suitable for applications that require real-time processing without the need for high-speed operation.

Technical Specifications

Microcontrollers S912ZVL96F0MLF attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

S12Z

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

2

No. of I/O Lines:

35

No. of Serial I/Os:

3

No. of Terminals:

48

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

ROM Words:

98304

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Current:

27 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

2048

Connectivity:

CAN, I2C, SCI(2), SPI

Peripherals:

POR, PWM(8), TIMER(8), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

S912ZVL96F0MLF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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