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AT91SAM7X512B-AU

Microchip Technology

AT91SAM7X512B-AU by Microchip Technology

AT91SAM7X512B-AU by Microchip: ARM7 CPU, 32-bit, 50 MHz clock speed. Ideal for industrial applications with ADC and DMA channels, 62 I/O lines, and FLASH ROM programmability. Operating temperature range -40 to 85 °C, package style flatpack with low profile.

Median Price

$9.960

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Farnell

UK . 99 parts In-Stock

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$9.960

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$8.470

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Nova Conductors

Japan . 870 parts In-Stock

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$18.997

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Mobius Materials

USA . 79 parts In-Stock

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$22.490

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$17.970

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Vyrian

USA . 7,050 parts In-Stock

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VNN

France . 1,622 parts In-Stock

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Chip Stock

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Digiode

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Component Sense

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Cyclops Electronics Ltd

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Ampacity Inc.

Singapore . 749 parts In-Stock

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$3.000

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$3.000

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AZTECH Wire

Italy . 626 parts In-Stock

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$18.774

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Continental Prestige Electronics

USA . 3,623 parts In-Stock

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$18.997

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$18.617

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Modulus Dynamics

Lithuania . 15 parts In-Stock

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$21.087

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$20.876

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Semicontronic

India . 1,229 parts In-Stock

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$29.000

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$28.275

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$28.130

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Microchip USA

USA . 377 parts In-Stock

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$31.500

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Advanced Electronics

New Zealand . 190 parts In-Stock

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Corohmni

South Africa . 483 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,380 parts In-Stock

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Vigor

Singapore . 200 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,219 parts In-Stock

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Lixinc

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Alle Elektronik GmbH

Germany . 4,279 parts In-Stock

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Supply Digital

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RGB Technical Solutions

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Robosynatics

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Lucentia Tech

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Argo Parts USA

USA . 886 parts In-Stock

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RC Electronics

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iodParts Technologies Inc.

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Corphita

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Overview

Elevate your projects with the AT91SAM7X512B-AU by Microchip Technology, a top-quality microcontroller that delivers unmatched performance and reliability. Designed by the industry leader in semiconductor solutions, this product is perfect for a wide range of applications in various industries. With its advanced features and cutting-edge technology, the AT91SAM7X512B-AU offers exceptional value and benefits to our customers, providing them with a competitive edge in their projects. Upgrade to Microchip Technology and experience excellence like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers good mechanical strength and electrical insulation, making the microcontroller durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and cost-effective PCB assembly, saving space and reducing manufacturing time.

Maximum Supply Voltage: 1.95 V

Low maximum supply voltage helps in reducing power consumption and improving the overall energy efficiency of the product.

Bit Size: 32

32-bit architecture enables high-performance computing and processing capability, making the microcontroller suitable for complex applications.

CPU Family: ARM7

ARM7 CPU family offers advanced features and capabilities, providing a reliable and efficient processing platform for diverse applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures the microcontroller can function in extreme environmental conditions, enhancing its reliability and versatility.

Maximum Clock Frequency: 50 MHz

High clock frequency allows for fast data processing and execution speed, making the microcontroller suitable for applications requiring real-time performance.

ROM Programmability: FLASH

Flash programmable ROM enables easy and flexible firmware updates, enhancing the reusability and adaptability of the microcontroller.

Technical Specifications

Microcontrollers AT91SAM7X512B-AU attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

AT91SAM7X512B-AU Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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