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S912XET256BCAAR

NXP Semiconductors

S912XET256BCAAR by NXP Semiconductors

MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: QFP; Package Shape: SQUARE;

Median Price

$13.020

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$12.700

10k+ parts

-

9,750

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-

$12.700

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Rochester

USA . 2,124 parts In-Stock

1+ parts

-

100+ parts

$13.340

1k+ parts

$11.930

10k+ parts

$11.230

2,124

-

$13.340

$11.930

$11.230

Flip Electronics (Authorized)

USA . 883 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

883

-

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,861 parts In-Stock

1+ parts

$10.659

100+ parts

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3,861

$10.659

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Vyrian

USA . 9,943 parts In-Stock

1+ parts

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9,943

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Anansix

USA . 2,250 parts In-Stock

1+ parts

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2,250

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Flip Electronics

USA . 883 parts In-Stock

1+ parts

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100+ parts

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883

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 385 parts In-Stock

1+ parts

$9.190

100+ parts

-

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385

$9.190

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Corphita

USA . 2,770 parts In-Stock

1+ parts

$10.098

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2,770

$10.098

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Vigor

Singapore . 1,194 parts In-Stock

1+ parts

$16.750

100+ parts

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1,194

$16.750

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Microchip USA

USA . 3,204 parts In-Stock

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3,204

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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UNI Independent Distributors

Spain . 2,728 parts In-Stock

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100+ parts

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2,728

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Technical Specifications

Microcontrollers S912XET256BCAAR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

HCS12X

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of I/O Lines:

59

No. of Serial I/Os:

8

No. of Terminals:

80

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.68SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

2.45 mm

Speed:

50 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

4K

Connectivity:

I2C, SCI(2), SPI(3)

Peripherals:

CAN(3), COMPARATOR(4), PWM(8), WDT

Analog To Digital Convertors:

1-Ch 8-Bit

Trade Compliance

S912XET256BCAAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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