Loading...

MC68HC11A1MFNE

NXP Semiconductors

MC68HC11A1MFNE by NXP Semiconductors

MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: J BEND; No. of Terminals: 52; Package Shape: SQUARE; Maximum Clock Frequency: 12 MHz;

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,169 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,169

-

-

-

-

Anansix

USA . 2,012 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,012

-

-

-

-

Digiode

USA . 1,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,775

-

-

-

-

Microfarads

USA . 251 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

251

-

-

-

-

Bristol Electronics

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,188 parts In-Stock

1+ parts

$18.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,188

$18.000

-

-

-

AZTECH Wire

Italy . 396 parts In-Stock

1+ parts

$20.620

100+ parts

-

1k+ parts

-

10k+ parts

-

396

$20.620

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 18,138 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,138

-

-

-

-

Microchip USA

USA . 4,914 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,914

-

-

-

-

UNI Independent Distributors

Spain . 4,648 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,648

-

-

-

-

Corphita

USA . 3,567 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,567

-

-

-

-

Technical Specifications

Microcontrollers MC68HC11A1MFNE attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

Boundary Scan:

NO

CPU Family:

HC11

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-J52

Low Power Mode:

NO

No. of External Interrupts:

2

No. of I/O Lines:

38

No. of Serial I/Os:

1

No. of Terminals:

52

No. of Timers:

1

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RAM Bytes:

256

Speed:

3 rpm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Peripheral IC Type:

Data EEPROM Size:

512

Connectivity:

SCI, SPI

Peripherals:

TIMER, WDT

Analog To Digital Convertors:

8-Ch 8-Bit

Trade Compliance

MC68HC11A1MFNE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20