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MC68HC11E1CFNE3

NXP Semiconductors

MC68HC11E1CFNE3 by NXP Semiconductors

MC68HC11E1CFNE3 by NXP Semiconductors is an 8-bit microcontroller with a clock frequency of 12 MHz, suitable for industrial applications. It features a 16-bit address bus width and operates b/w -40 to 85 °C temperature range. With 38 I/O lines, it is ideal for various embedded systems requiring high-speed processing.

Median Price

$13.540

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 2,402 parts In-Stock

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-

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$13.540

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$12.110

10k+ parts

$11.400

2,402

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$13.540

$12.110

$11.400

Distributors (In-Stock)

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Digiode

USA . 3,359 parts In-Stock

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$14.336

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3,359

$14.336

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Nova Conductors

Japan . 50 parts In-Stock

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$22.149

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$22.149

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Flip Electronics

USA . 4,186 parts In-Stock

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Vyrian

USA . 3,902 parts In-Stock

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3,902

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Chip Stock

USA . 3,478 parts In-Stock

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NexGen Digital

USA . 3,440 parts In-Stock

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Anansix

USA . 866 parts In-Stock

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LWI Electronics Inc

India . 42 parts In-Stock

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ComSIT Distribution GmbH

Germany . 41 parts In-Stock

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Rebound Electronics

UK . 27 parts In-Stock

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Bristol Electronics

USA . 11 parts In-Stock

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Semtec, LLC

USA . 2 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,482 parts In-Stock

1+ parts

$12.830

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3,482

$12.830

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Semicontronic

India . 3,432 parts In-Stock

1+ parts

$12.830

100+ parts

$12.509

1k+ parts

$12.445

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3,432

$12.830

$12.509

$12.445

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One Stop Electronics

USA . 3,167 parts In-Stock

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$12.830

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3,167

$12.830

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Corphita

USA . 4,486 parts In-Stock

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$13.581

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$13.581

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Continental Prestige Electronics

USA . 2,728 parts In-Stock

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$22.149

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$21.707

2,728

$22.149

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$21.707

Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$22.592

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$22.592

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$22.592

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$22.592

$22.592

$22.592

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Modulus Dynamics

Lithuania . 1,283 parts In-Stock

1+ parts

$58.005

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$58.005

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$58.005

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$58.005

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Corohmni

South Africa . 411 parts In-Stock

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$69.962

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$69.962

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Aztec Data Supply Inc.

USA . 81 parts In-Stock

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$75.860

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81

$75.860

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Microchip USA

USA . 361 parts In-Stock

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$207.299

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361

$207.299

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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UNI Independent Distributors

Spain . 2,693 parts In-Stock

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Infinite Electronics LLP (Excess)

. 1,980 parts In-Stock

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Robosynatics

Brazil . 991 parts In-Stock

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Lucentia Tech

USA . 991 parts In-Stock

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$33.136

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$32.460

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$32.460

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$32.460

$32.460

Argo Parts USA

USA . 775 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$21.707

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$21.042

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$20.599

50

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$21.042

$20.599

iodParts Technologies Inc.

India . 46 parts In-Stock

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Overview

Unleash the power of innovation with the MC68HC11E1CFNE3 by NXP Semiconductors. As a leader in microcontrollers, NXP delivers top-quality products that redefine industry standards. This versatile chip is perfect for a wide range of applications, offering unparalleled performance and reliability. Experience seamless integration, optimal efficiency, and unmatched value with the MC68HC11E1CFNE3. Elevate your projects to new heights with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 5.5 V

Can handle a wide range of supply voltages, providing flexibility in system design.

Address Bus Width: 16

Having a wide address bus allows for access to a larger memory space, suitable for complex applications.

Package Shape: SQUARE

Square shape is space-efficient and can be easily accommodated on a PCB layout.

Bit Size: 8

8-bit processing capability allows for handling a moderate amount of data efficiently.

No. of Terminals: 52

Sufficient number of terminals for connecting with other components in a system.

Package Style (Meter): CHIP CARRIER

Chip carrier package style is compact and suitable for high-density PCB designs.

Minimum Supply Voltage: 4.5 V

Can operate at low supply voltages, saving power and reducing heat generation.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operational in low temperatures, enabling use in diverse environments.

Terminal Finish: TIN

Tin finish provides good solderability and corrosion resistance for reliable connections.

ADC Channels: YES

Presence of analog-to-digital converter channels allows for interfacing with analog sensors and signals.

Terminal Position: QUAD

Quad terminal position facilitates easy PCB layout and routing of signals.

Maximum Seated Height: 5.08 mm

Low profile design saves space on the PCB and enables compact system designs.

Width: 19.125 mm

Compact width enables integration into systems with space constraints.

External Data Bus Width: 8

8-bit external data bus width allows for efficient communication with external devices.

Maximum Clock Frequency: 12 MHz

High clock frequency enables fast processing and responsiveness in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand reflow soldering process for sufficient time during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures reliable soldering during assembly.

Length: 19.125 mm

Compact length allows for space-saving integration into small form factor devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller applications, ensuring optimal performance and functionality.

Technology: HCMOS

High-speed CMOS technology provides efficient processing capabilities with low power consumption.

Terminal Form: J BEND

J Bend terminals make soldering easier and provide mechanical strength for reliable connections.

Nominal Supply Voltage: 5 V

Stable 5V supply voltage ensures consistent operation of the microcontroller.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy soldering and PCB assembly processes.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, suitable for standard handling and storage practices.

Speed: 3 rpm

Operates at a moderate speed suitable for microcontroller applications with real-time requirements.

No. of I/O Lines: 38

Sufficient number of I/O lines for interfacing with external components and peripherals in a system.

Technical Specifications

Microcontrollers MC68HC11E1CFNE3 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

SEATED HT-CALCULATED

Address Bus Width:

16

Bit Size:

8

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e3

Length:

19.125 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Maximum Seated Height:

5.08 mm

Speed:

3 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19.125 mm

Peripheral IC Type:

Trade Compliance

MC68HC11E1CFNE3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-609-0205, 5962016090205

NIIN

016090205

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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