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MC68HC705C8ACFNE

NXP Semiconductors

MC68HC705C8ACFNE by NXP Semiconductors

MC68HC705C8ACFNE by NXP Semiconductors is an 8-bit microcontroller with 44 terminals, operating at a max frequency of 4.2 MHz. It features 176 bytes of RAM and 7744 ROM words, suitable for industrial applications requiring a temperature range from -40 to 85°C.

Median Price

$13.480

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 26 parts In-Stock

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$13.480

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$12.670

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$11.450

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$11.450

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Flip Electronics (Authorized)

USA . 5,534 parts In-Stock

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EBV Elektronik

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Digiode

USA . 2,956 parts In-Stock

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$12.806

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Nova Conductors

Japan . 300 parts In-Stock

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$24.031

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Chip Stock

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Vyrian

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Anansix

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Mil-Aero Solutions, Inc.

USA . 2,315 parts In-Stock

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Flip Electronics

USA . 2,281 parts In-Stock

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Avant Electronics Limited

UK . 382 parts In-Stock

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Component Sense

UK . 188 parts In-Stock

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ComSIT Distribution GmbH

Germany . 35 parts In-Stock

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ComSIT USA

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ABC Electronics Ltd.

UK . 27 parts In-Stock

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NexGen Digital

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J2 Sourcing AB

Sweden . 19 parts In-Stock

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Pegasus Components GmbH

Germany . 18 parts In-Stock

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4 Star Electronics, Inc.

USA . 16 parts In-Stock

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Bristol Electronics

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Astute Electronics Inc

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LWI Electronics Inc

India . 3 parts In-Stock

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Classic Components Corporation

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Distributors (Availability)

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Semicontronic

India . 1,680 parts In-Stock

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$11.460

100+ parts

$11.174

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$11.116

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1,680

$11.460

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$11.116

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Ampacity Inc.

Singapore . 1,378 parts In-Stock

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$11.460

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Corphita

USA . 2,363 parts In-Stock

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$12.132

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Aranea Global

USA . 500 parts In-Stock

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$23.550

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$22.608

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$23.550

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Continental Prestige Electronics

USA . 1,815 parts In-Stock

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$24.031

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$23.550

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Microchip USA

USA . 433 parts In-Stock

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$47.169

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Corohmni

South Africa . 258 parts In-Stock

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$69.064

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$77.477

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$73.603

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Aztec Data Supply Inc.

USA . 3,691 parts In-Stock

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$81.392

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Modulus Dynamics

Lithuania . 3,441 parts In-Stock

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$84.536

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$84.536

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A-Z Elektronik GmbH

Germany . 10,500 parts In-Stock

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Kepictronics

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UNI Independent Distributors

Spain . 4,607 parts In-Stock

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Perfect Parts

USA . 4,567 parts In-Stock

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Argo Parts USA

USA . 3,857 parts In-Stock

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S.R.D Solutions

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Lixinc

USA . 2,530 parts In-Stock

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Futuretech Components

Singapore . 1,761 parts In-Stock

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Emar International I/E

Canada . 500 parts In-Stock

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Robosynatics

Brazil . 425 parts In-Stock

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$41.077

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$40.238

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$40.238

425

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Lucentia Tech

USA . 425 parts In-Stock

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$41.077

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iodParts Technologies Inc.

India . 35 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 27 parts In-Stock

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Overview

Unleash the power of innovation with the MC68HC705C8ACFNE microcontroller by NXP Semiconductors. Crafted with precision and expertise, this chip offers unparalleled performance and reliability in a wide range of applications. Whether you're looking to enhance your smart home devices or streamline industrial automation, this microcontroller delivers seamless operation and robust functionality. Elevate your projects to new heights with the MC68HC705C8ACFNE and experience the quality and value that only NXP Semiconductors can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for portable and rugged applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy assembly, saving space on the PCB.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, providing flexibility in power supply options.

Bit Size: 8

8-bit architecture offers a good balance between performance and cost for a variety of applications.

No. of Terminals: 44

Sufficient number of terminals for interfacing with external components and peripherals.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides good thermal performance and reliability.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the microcontroller to function in harsh environments.

ROM Words: 7744

Ample ROM capacity for storing program code and data.

Maximum Clock Frequency: 4.2 MHz

High clock frequency allows for fast processing of instructions.

RAM Bytes: 176

Adequate RAM for temporary data storage during program execution.

Technical Specifications

Microcontrollers MC68HC705C8ACFNE attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Additional Features:

OPERATES AT 3.3V SUPPLY @ 1 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

6805

Maximum Clock Frequency:

4.2 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.5862 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

31

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

RAM Bytes:

176

ROM Words:

7744

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Speed:

2.1 rpm

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.5862 mm

Peripheral IC Type:

Trade Compliance

MC68HC705C8ACFNE Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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