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S912XET256BMAGR

NXP Semiconductors

S912XET256BMAGR by NXP Semiconductors

NXP Semiconductors' S912XET256BMAGR microcontroller features 32-bit architecture, 22-bit address bus, and 8-bit on-chip data RAM. Ideal for automotive applications, it offers CAN(3), PWM(8), and WDT peripherals with a max clock frequency of 40 MHz. With low power mode and FLASH ROM programmability, this microcontroller is suitable for various automotive control systems.

Median Price

$11.844

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,000 parts In-Stock

1+ parts

$8.760

100+ parts

$8.580

1k+ parts

$8.410

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2,000

$8.760

$8.580

$8.410

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Verical

USA . 10,000 parts In-Stock

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-

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$14.929

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$14.929

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Distributors (In-Stock)

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Vyrian

USA . 7,445 parts In-Stock

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7,445

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Flip Electronics

USA . 5,500 parts In-Stock

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5,500

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Digiode

USA . 3,551 parts In-Stock

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3,551

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Anansix

USA . 699 parts In-Stock

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699

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Nova Conductors

Japan . 15 parts In-Stock

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15

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Distributors (Availability)

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One Stop Electronics

USA . 770 parts In-Stock

1+ parts

$4.000

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770

$4.000

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Vigor

Singapore . 2,000 parts In-Stock

1+ parts

$10.590

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$10.590

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AZTECH Wire

Italy . 800 parts In-Stock

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$14.700

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800

$14.700

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Ampacity Inc.

Singapore . 736 parts In-Stock

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$18.000

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736

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Corohmni

South Africa . 311 parts In-Stock

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$65.079

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UNI Independent Distributors

Spain . 5,083 parts In-Stock

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Corphita

USA . 4,804 parts In-Stock

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Microchip USA

USA . 1,617 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Overview

Elevate your projects with the S912XET256BMAGR microcontroller by NXP Semiconductors. Designed with cutting-edge technology and unmatched precision, this device is perfect for automotive applications, offering seamless connectivity and low power mode for optimal performance. Experience the benefits of its advanced features, including dual analog-to-digital converters and multiple peripherals like CAN and PWM channels. Trust in NXP Semiconductors to deliver top-quality solutions that push the boundaries of innovation. Upgrade your designs today with the S912XET256BMAGR microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the microcontroller a reliable choice for various applications.

Maximum Supply Voltage: 5.5 V

Can operate at high voltages, providing versatility in power supply options.

CPU Family: HCS12X

The HCS12X family offers advanced features and performance, making it suitable for complex applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates various peripherals and functions in a single chip, reducing external components and PCB space.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for fast processing and response times in real-time applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall efficiency.

ADC Channels: YES

Built-in Analog to Digital Converters enable the microcontroller to interface with analog sensors and signals.

Connectivity: I2C, SCI(4), SPI(3)

Support for multiple communication protocols enables seamless integration with other devices and systems.

Technical Specifications

Microcontrollers S912XET256BMAGR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

Boundary Scan:

NO

CPU Family:

HCS12X

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of I/O Lines:

119

No. of Serial I/Os:

8

No. of Terminals:

144

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

4K

Connectivity:

I2C, SCI(4), SPI(3)

Peripherals:

CAN(3), COMPARATOR(4), PWM(8), WDT

Analog To Digital Convertors:

2-Ch 24-Bit

Trade Compliance

S912XET256BMAGR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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