Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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LPC4072FET80K
NXP Semiconductors
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 80; Package Code: TFBGA; Package Shape: SQUARE; Peripherals: BOD, DMA(8), POR, PWM(2), RTC, TIMER(4), WDT;
YES
0
32
CORTEX-M4
25 MHz
7 mm
3
80
8
85 Cel
-40 Cel
TFBGA
SQUARE
GRID ARRAY, THIN PROFILE, FINE PITCH
260
24576
65536
FLASH
120 rpm
3.6 V
2.4 V
3.3 V
BALL
.65 mm
BOTTOM
MICROCONTROLLER, RISC
2K
CAN(2), I2C(3), I2S, SSP(3), UART(4), USART
BOD, DMA(8), POR, PWM(2), RTC, TIMER(4), WDT
8-Ch 12-Bit
1-Ch 10-Bit
LPC4076FET180K
MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 180; Package Code: TFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH;
16
12 mm
180
81920
262144
.8 mm
BOD, COMPARATOR, DMA(8), POR, PWM(2), RTC, TIMER(4), WDT
LPC4330FBD144Y
MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Speed: 204 rpm;
24
e3
20 mm
83
144
LFQFP
FLATPACK, LOW PROFILE, FINE PITCH
2700336
n/s
204 rpm
2.2 V
TIN
GULL WING
.5 mm
QUAD
30
CAN, I2C(2), I2S(2), SSP(2), UART(2), USART(4)
BOD, DMA(8), POR, PWM, RTC, TIMER(6), WDT
8-Ch 10-Bit (2)
LPC4337JET256Y
NXP Semiconductors' LPC4337JET256Y is a 32-bit microcontroller with 256 terminals, operating at up to 25 MHz. It features 8 ADC channels, CAN, Ethernet, and USB connectivity. Ideal for applications requiring high-speed data processing and multiple I/O interfaces in a compact square package.
17 mm
164
256
105 Cel
LBGA
GRID ARRAY, LOW PROFILE
139264
1048576
1 mm
16K
CAN(2), ETHERNET, I2C(2), I2S(2), SDMMC, SPI, SPIFI, SSP(2), UART, USART(3), USB(2)
MC705P6AMDWER
MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; External Data Bus Width: 0;
ALSO OPERATES AT 3.3 V SUPPLY
NO
M68HC05
4.2 MHz
FIXED POINT
R-PDSO-G28
17.925 mm
1
21
28
PLASTIC/EPOXY
SOP
SOP28,.4
RECTANGULAR
SMALL OUTLINE
176
4672
EPROM
2.65 mm
2.1 rpm
7 mA
5.5 V
4.5 V
5 V
CMOS
1.27 mm
DUAL
40
7.5 mm
MICROCONTROLLER
POR, TIMER, WDT
4-Ch 8-Bit
MC9S08AC128CFGER
MICROCONTROLLER; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;
MC9S08AC96CFUER
MICROCONTROLLER; Terminal Finish: TIN; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
MK11DN512AVLK5R
MICROCONTROLLER, RISC; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
MK21DN512AVMC5R
MICROCONTROLLER, RISC; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
e1
TIN SILVER COPPER
MK21DX256AVMC5R
MICROCONTROLLER, RISC; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
MKV46F256VLL16Q
NXP Semiconductors' MKV46F256VLL16Q microcontroller features a 32-bit CPU CORTEX-M4 with 262144 ROM words. It offers 18-Ch/20-Ch ADC, 1-Ch DAC, and peripherals like PWM(12) and TIMER(22). Ideal for applications requiring low power mode, it operates b/w -40 to 105 °C with a max clock frequency of 48 MHz.
48 MHz
FLOATING POINT
S-PQFP-G100
14 mm
74
4
100
23
QFP100,.63SQ,20
32768
1.7 mm
168 rpm
53.2 mA
1.71 V
FLEXCAN(2), I2C, SPI, UART(2)
ANALOG COMPARATOR(4), DMA(16), PWM(12), TIMER(22), WDT
18-Ch 12-Bit, 20-Ch 12-Bit
1-Ch 12-Bit
S912B32E4CFUE8R
MICROCONTROLLER; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; JESD-609 Code: e3;
S912B32E4CFUE8
MICROCONTROLLER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; JESD-609 Code: e3;
S912B32E4MFUE8R
MICROCONTROLLER; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3;
S912B32E4VFUE8R
MICROCONTROLLER; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
S912XHY128F0CLM
MICROCONTROLLER; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;
S9S08EL16F1MTLR
S9S08EL16F1MTL
MICROCONTROLLER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;
S9S08EL32F1CTLR
MICROCONTROLLER; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260;
S9S08EL32F1MTL
MICROCONTROLLER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN;
S9S08EL32F1VTLR
MICROCONTROLLER; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3;
S9S08EL32F1VTL
MICROCONTROLLER; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40;
S9S08SL16F1CTLR
MICROCONTROLLER; JESD-609 Code: e3; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
S9S08SL16F1MTJR
MICROCONTROLLER; JESD-609 Code: e3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
S9S08SL16F1MTJ
MICROCONTROLLER; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
S9S08SL16F1MTLR
MICROCONTROLLER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; JESD-609 Code: e3;
S9S08SL16F1MTL
MICROCONTROLLER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; JESD-609 Code: e3;
S9S08SL16F1VTLR
MICROCONTROLLER; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
S9S08SL16F1VTL
S9S08SL8F1CTJR
MICROCONTROLLER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3;
S9S08SL8F1CTJ
MICROCONTROLLER; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3;
S9S08SL8F1MTJR
MICROCONTROLLER; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
S9S08SL8F1MTJ
S9S08SL8F1MTLR
MICROCONTROLLER; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN;
S9S08SL8F1MTL
MICROCONTROLLER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Terminal Finish: TIN;
S9S08SL8F1VTJR
S9S12XS256J0MALR
MICROCONTROLLER, RISC; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3;
SPC5643AF0MLU2R
MICROCONTROLLER; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN;
SPC5644AF0MMG2R
MICROCONTROLLER; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER; Peak Reflow Temperature (C): 260; JESD-609 Code: e2; Moisture Sensitivity Level (MSL): 3;
e2
TIN SILVER
SPC5644CF0CLU8R
MICROCONTROLLER; Terminal Finish: Tin (Sn); JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
Tin (Sn)
SPC5644CF0CLU8
MICROCONTROLLER; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: Tin (Sn); Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Peak Reflow Temperature (C): 260;
SPC5644CF0VLU8R
UJA1076ATW/3V3/WDJ
MICROCONTROLLER; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 1;
e4
NICKEL PALLADIUM GOLD SILVER
SPC5675KF0MMM2
MICROCONTROLLER; Terminal Finish: TIN SILVER; JESD-609 Code: e2; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
SPC5675KF0MMS2
MICROCONTROLLER; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e2;
SPC5675KF0VMS2
MICROCONTROLLER; JESD-609 Code: e2; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER;
SPC5675KFF0VMM2R
MICROCONTROLLER; Peak Reflow Temperature (C): 260; JESD-609 Code: e2; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER; Moisture Sensitivity Level (MSL): 3;
SPC5675KFF0VMM2
MICROCONTROLLER; JESD-609 Code: e2; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
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