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MKV46F256VLL16Q

NXP Semiconductors

MKV46F256VLL16Q by NXP Semiconductors

NXP Semiconductors' MKV46F256VLL16Q microcontroller features a 32-bit CPU CORTEX-M4 with 262144 ROM words. It offers 18-Ch/20-Ch ADC, 1-Ch DAC, and peripherals like PWM(12) and TIMER(22). Ideal for applications requiring low power mode, it operates b/w -40 to 105 °C with a max clock frequency of 48 MHz.

Median Price

$7.984

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$7.984

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Vyrian

USA . 4,402 parts In-Stock

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Anansix

USA . 651 parts In-Stock

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Digiode

USA . 132 parts In-Stock

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One Stop Electronics

USA . 1,477 parts In-Stock

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$6.000

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AZTECH Wire

Italy . 575 parts In-Stock

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$7.285

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Continental Prestige Electronics

USA . 5,108 parts In-Stock

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$7.808

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$7.652

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$7.652

Netroflash

USA . 100 parts In-Stock

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$7.984

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$7.585

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$7.425

100

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$7.585

$7.425

Ampacity Inc.

Singapore . 876 parts In-Stock

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$26.000

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Semicontronic

India . 923 parts In-Stock

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$27.300

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$27.160

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Aztec Data Supply Inc.

USA . 1,516 parts In-Stock

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Corohmni

South Africa . 477 parts In-Stock

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Microchip USA

USA . 6,730 parts In-Stock

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UNI Independent Distributors

Spain . 6,319 parts In-Stock

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Argo Parts USA

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Corphita

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Robosynatics

Brazil . 300 parts In-Stock

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Lucentia Tech

USA . 300 parts In-Stock

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$14.500

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$14.500

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$14.500

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$14.500

Overview

Get ready to take your projects to the next level with the MKV46F256VLL16Q microcontroller by NXP Semiconductors. Known for its high-quality products, NXP has designed this microcontroller to offer unmatched performance and reliability. Whether you're working on IoT devices, automotive applications, or industrial automation, this versatile microcontroller has you covered. With advanced features like multiple DAC and ADC channels, low power mode, and a wide range of connectivity options, the MKV46F256VLL16Q delivers exceptional value and flexibility to meet your project requirements. Elevate your designs with NXP's cutting-edge technology and unleash your creativity like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, ensuring the product will have a long lifespan.

Maximum Supply Voltage: 3.6 V

Allows flexibility in power supply options for different applications.

CPU Family: CORTEX-M4

A powerful and efficient CPU family that provides high performance for various tasks.

ADC Channels: YES

Ability to perform analog to digital conversion, enabling the product to interface with a variety of sensors.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing and improved performance.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the software on the microcontroller.

Connectivity: FLEXCAN(2), I2C, SPI, UART(2)

Support for multiple communication protocols, making it versatile and compatible with a wide range of devices.

Low Power Mode: YES

Enables energy efficiency and prolongs battery life, making it suitable for applications that require low power consumption.

Technical Specifications

Microcontrollers MKV46F256VLL16Q attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of I/O Lines:

74

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

23

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

168 rpm

Maximum Supply Current:

53.2 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

FLEXCAN(2), I2C, SPI, UART(2)

Peripherals:

ANALOG COMPARATOR(4), DMA(16), PWM(12), TIMER(22), WDT

Analog To Digital Convertors:

18-Ch 12-Bit, 20-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

MKV46F256VLL16Q Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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