Loading...

S912XHY128F0CLM

NXP Semiconductors

S912XHY128F0CLM by NXP Semiconductors

MICROCONTROLLER; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;

Median Price

$6.730

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$6.730

1k+ parts

$6.020

10k+ parts

$5.660

9,000

-

$6.730

$6.020

$5.660

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,389 parts In-Stock

1+ parts

$7.096

100+ parts

-

1k+ parts

-

10k+ parts

-

2,389

$7.096

-

-

-

Vyrian

USA . 4,597 parts In-Stock

1+ parts

$7.470

100+ parts

-

1k+ parts

-

10k+ parts

-

4,597

$7.470

-

-

-

Cyclops Electronics Ltd

UK . 8,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,100

-

-

-

-

Anansix

USA . 2,481 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,481

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 979 parts In-Stock

1+ parts

$6.723

100+ parts

-

1k+ parts

-

10k+ parts

-

979

$6.723

-

-

-

Vigor

Singapore . 2,055 parts In-Stock

1+ parts

$11.137

100+ parts

-

1k+ parts

-

10k+ parts

-

2,055

$11.137

-

-

-

AZTECH Wire

Italy . 718 parts In-Stock

1+ parts

$18.760

100+ parts

-

1k+ parts

-

10k+ parts

-

718

$18.760

-

-

-

Microchip USA

USA . 2,516 parts In-Stock

1+ parts

$25.577

100+ parts

-

1k+ parts

-

10k+ parts

-

2,516

$25.577

-

-

-

Perfect Parts

USA . 26,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,880

-

-

-

-

A-Z Elektronik GmbH

Germany . 8,294 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,294

-

-

-

-

Kepictronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

UNI Independent Distributors

Spain . 3,233 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,233

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Futuretech Components

Singapore . 867 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

867

-

-

-

-

Technical Specifications

Microcontrollers S912XHY128F0CLM attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

S912XHY128F0CLM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20