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LPC1517JBD64Y

NXP Semiconductors

LPC1517JBD64Y by NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE; Peripherals: BOD, COMPARATOR(4), DMA(18), PWM, RTC, TIMER(12), WDT;

Median Price

$5.262

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,000 parts In-Stock

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$5.262

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$5.262

Distributors (In-Stock)

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Digiode

USA . 4,792 parts In-Stock

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Vyrian

USA . 4,399 parts In-Stock

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Anansix

USA . 2,462 parts In-Stock

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Flip Electronics

USA . 1,500 parts In-Stock

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Sensible Micro Corp

USA . 685 parts In-Stock

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685

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Distributors (Availability)

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Vigor

Singapore . 2,418 parts In-Stock

1+ parts

$6.014

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$6.014

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AZTECH Wire

Italy . 829 parts In-Stock

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$13.070

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829

$13.070

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Microchip USA

USA . 3,881 parts In-Stock

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$15.284

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One Stop Electronics

USA . 536 parts In-Stock

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$27.000

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UNI Independent Distributors

Spain . 4,805 parts In-Stock

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Corphita

USA . 2,896 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Technical Specifications

Microcontrollers LPC1517JBD64Y attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

RAM Bytes:

12288

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

72 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

4K

Connectivity:

CAN, I2C, SPI(2), USART(3)

Peripherals:

BOD, COMPARATOR(4), DMA(18), PWM, RTC, TIMER(12), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

LPC1517JBD64Y Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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