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LPC2210FBD144/01K

NXP Semiconductors

LPC2210FBD144/01K by NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; DAC Channels: NO;

Median Price

$13.588

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 120 parts In-Stock

1+ parts

$13.327

100+ parts

-

1k+ parts

$6.789

10k+ parts

$6.718

120

$13.327

-

$6.789

$6.718

Verical

USA . 120 parts In-Stock

1+ parts

$13.327

100+ parts

-

1k+ parts

$6.789

10k+ parts

$6.718

120

$13.327

-

$6.789

$6.718

Mouser Electronics

USA . 230 parts In-Stock

1+ parts

$13.850

100+ parts

-

1k+ parts

$7.330

10k+ parts

-

230

$13.850

-

$7.330

-

Chip1Stop

Japan . 120 parts In-Stock

1+ parts

$14.421

100+ parts

$8.162

1k+ parts

-

10k+ parts

-

120

$14.421

$8.162

-

-

DigiKey

USA . 570 parts In-Stock

1+ parts

$14.450

100+ parts

$8.179

1k+ parts

$7.335

10k+ parts

-

570

$14.450

$8.179

$7.335

-

Future Electronics

Canada . 9,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$7.770

10k+ parts

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9,000

-

-

$7.770

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,962 parts In-Stock

1+ parts

$12.661

100+ parts

-

1k+ parts

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2,962

$12.661

-

-

-

Vyrian

USA . 8,786 parts In-Stock

1+ parts

-

100+ parts

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8,786

-

-

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Chip Stock

USA . 6,900 parts In-Stock

1+ parts

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6,900

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Anansix

USA . 862 parts In-Stock

1+ parts

-

100+ parts

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862

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,015 parts In-Stock

1+ parts

$11.994

100+ parts

-

1k+ parts

-

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3,015

$11.994

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-

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Vigor

Singapore . 581 parts In-Stock

1+ parts

$12.530

100+ parts

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581

$12.530

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QUARKTWIN TECHNOLOGY LTD

USA . 5,430 parts In-Stock

1+ parts

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1k+ parts

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5,430

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UNI Independent Distributors

Spain . 4,953 parts In-Stock

1+ parts

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4,953

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Microchip USA

USA . 3,649 parts In-Stock

1+ parts

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3,649

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Technical Specifications

Microcontrollers LPC2210FBD144/01K attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3 V SUPPLY

Address Bus Width:

24

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

32

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

76

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

Speed:

75 rpm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Connectivity:

I2C, SPI, SSP, UART(2)

Peripherals:

PWM, RTC, TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC2210FBD144/01K Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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