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LPC2103FBD48,151

NXP Semiconductors

LPC2103FBD48,151 by NXP Semiconductors

NXP Semiconductors' LPC2103FBD48,151 is a 32-bit ARM7 microcontroller with 32 I/O lines and 8192 bytes of RAM. It operates at a max clock frequency of 25 MHz and has ROM programmability using FLASH technology. Ideal for industrial applications requiring a low-profile, fine-pitch package style with a temperature range from -40 to 85°C.

Median Price

$5.160

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 1 parts In-Stock

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$5.160

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$4.620

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$4.340

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Nova Conductors

Japan . 16 parts In-Stock

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$4.023

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Digiode

USA . 3,196 parts In-Stock

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$6.754

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Vyrian

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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Micros

Poland . 20 parts In-Stock

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$5.219

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Distributors (Availability)

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Vigor

Singapore . 590 parts In-Stock

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$3.990

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Continental Prestige Electronics

USA . 4,017 parts In-Stock

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$4.023

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$3.943

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Argo Parts USA

USA . 856 parts In-Stock

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$4.023

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Netroflash

USA . 100 parts In-Stock

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$3.822

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$3.742

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$3.742

Semicontronic

India . 6 parts In-Stock

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$6.040

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$5.889

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$5.859

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Corphita

USA . 385 parts In-Stock

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$6.399

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Ampacity Inc.

Singapore . 2 parts In-Stock

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AZTECH Wire

Italy . 197 parts In-Stock

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Corohmni

South Africa . 1,975 parts In-Stock

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Advanced Electronics

New Zealand . 15 parts In-Stock

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$29.254

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Aztec Data Supply Inc.

USA . 188 parts In-Stock

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Microchip USA

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Perfect Parts

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Lixinc

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A-Z Elektronik GmbH

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UNI Independent Distributors

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Infinite Electronics LLP (Excess)

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iodParts Technologies Inc.

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Overview

Unlock the potential of your electronic designs with the LPC2103FBD48,151 microcontroller by NXP Semiconductors. This high-quality product offers unmatched reliability and performance, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this ARM7 CPU family device provides 32-bit processing power and advanced features like ADC channels and PWM channels. With a low profile package style and a maximum clock frequency of 25 MHz, this microcontroller delivers value, benefits, and advantages that will take your projects to the next level. Elevate your creations with the LPC2103FBD48,151 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness, making the product reliable and affordable.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 1.95 V

The maximum supply voltage of 1.95V ensures safe operation and helps in preventing voltage spikes that can damage the microcontroller.

Package Shape: SQUARE

The square package shape allows for more space-efficient PCB layout, making it suitable for compact designs.

Bit Size: 32

The 32-bit architecture provides higher performance compared to lower-bit microcontrollers, making it suitable for more demanding applications.

No. of Terminals: 48

Having 48 terminals allows for more I/O options and connectivity, enabling the microcontroller to interface with a variety of external devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the microcontroller can operate reliably in a wide range of environments and conditions.

CPU Family: ARM7

The ARM7 CPU family is known for its energy efficiency and high performance, making it a popular choice for embedded systems.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals to digital, enabling it to interface with sensors and other analog devices.

ROM Words: 32768

With 32K ROM words, the microcontroller has ample memory for storing program instructions and data, making it suitable for complex applications.

RAM Bytes: 8192

The 8K RAM provides sufficient memory for data storage and processing, enabling the microcontroller to handle multitasking and memory-intensive applications.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency allows for faster processing speed, enabling the microcontroller to execute instructions quickly and efficiently.

Technical Specifications

Microcontrollers LPC2103FBD48,151 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3 V SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

32

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

70 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LPC2103FBD48,151 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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