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LPC2148FBD64

NXP Semiconductors

LPC2148FBD64 by NXP Semiconductors

NXP Semiconductors' LPC2148FBD64 is a 32-bit ARM7 microcontroller with 3.3V supply, 25MHz clock frequency, and 40960 bytes of RAM. Ideal for industrial applications, it features DAC and ADC channels, PWM support, and operates in temperatures ranging from -40 to 85°C.

Median Price

$29.386

Lifecycle Status

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Chip Stock

USA . 3,900 parts In-Stock

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Connector Distribution Corp

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Goldney Electronics S.L.

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LIBRA Elektronik GmbH

Germany . 84 parts In-Stock

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LWI Electronics Inc

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Micros

Poland . 20 parts In-Stock

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Cyclops Electronics Ltd

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Nova Conductors

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ACDS - Activité Composants Distribution Service

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First Choice Components Inc.

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One Stop Electronics

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Ampacity Inc.

Singapore . 1,569 parts In-Stock

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Semicontronic

India . 550 parts In-Stock

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AZTECH Wire

Italy . 340 parts In-Stock

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South Africa . 66 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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Aztec Data Supply Inc.

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Overview

Discover the LPC2148FBD64 by NXP Semiconductors, a top-quality microcontroller perfect for a wide range of applications. With cutting-edge technology and reliable performance, this product offers unparalleled value and benefits to customers. Whether you're a tech enthusiast or an industry professional, this ARM7-based microcontroller provides the power and versatility you need to bring your projects to life. Trust NXP Semiconductors to deliver excellence in every aspect - from design to functionality. Elevate your creations with the LPC2148FBD64 and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand harsh conditions, making the product long-lasting and reliable.

Surface Mount: YES

Easy to mount on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

Can handle higher voltages, providing flexibility in power supply options.

Package Shape: SQUARE

Uniform shape that fits well in compact designs, optimizing space usage.

Bit Size: 32

High bit size allows for complex operations and calculations, suitable for advanced applications.

DAC Channels: YES

Ability to convert digital signals to analog signals, enabling precise control over output voltages.

Power Supplies (V): 3.3

Standard voltage supply that is commonly available, ensuring compatibility with various power sources.

No. of Terminals: 64

Sufficient number of terminals for connecting to external devices and components, enhancing versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Slim and compact package style that helps in fitting the product in tight spaces and increasing overall design efficiency.

Minimum Supply Voltage: 3 V

Lowest acceptable supply voltage that helps in reducing power consumption and heat generation.

Maximum Operating Temperature: 85 °C

Wide operating temperature range that allows the product to function reliably in varying environmental conditions.

CPU Family: ARM7

Efficient ARM7 architecture that delivers high performance and low power consumption, ideal for demanding computational tasks.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold environments without any issues, suitable for industrial and outdoor applications.

Terminal Finish: TIN

TIN finish on terminals provides excellent conductivity and corrosion resistance, ensuring reliable connections.

ADC Channels: YES

Analog-to-digital conversion capability allows for precise measurement and monitoring of external signals.

Terminal Position: QUAD

Quad terminal position facilitates easy PCB layout and soldering, improving manufacturing efficiency.

ROM Words: 524288

Large ROM capacity for storing program instructions and data, accommodating complex software requirements.

Maximum Seated Height: 1.6 mm

Low-profile design that helps in reducing the overall height of the product, suitable for compact applications.

Width: 10 mm

Compact width dimension that saves PCB space and allows for densely populated circuit boards.

Maximum Clock Frequency: 25 MHz

High clock frequency for fast processing speed, enabling quick execution of instructions and tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient reflow time to ensure proper soldering and component attachment during the manufacturing process.

Peak Reflow Temperature °C: 260

High peak reflow temperature that helps in achieving reliable solder joints and PCB assembly.

Length: 10 mm

Compact length dimension that contributes to the overall small form factor of the product.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures stable operation in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller design that offers efficient computational capabilities and low power consumption.

RAM Bytes: 40960

Adequate RAM capacity for storing temporary data and variables, essential for smooth program execution.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the overall performance of the product.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and robust mechanical connection, ensuring reliable electrical contact.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage that ensures consistent and reliable operation of the product.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of digital signals, useful for motor control and power management.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates and customization, providing flexibility for future enhancements.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density packaging, enabling compact and space-efficient PCB layouts.

Speed: 60 rpm

High processing speed of 60 revolutions per minute, suitable for real-time control and feedback applications.

No. of I/O Lines: 45

Sufficient number of input/output lines for connecting to external devices and sensors, enhancing overall functionality and versatility.

Technical Specifications

Microcontrollers LPC2148FBD64 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

45

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

40960

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LPC2148FBD64 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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