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LPC2138FBD64/01,15

NXP Semiconductors

LPC2138FBD64/01,15 by NXP Semiconductors

NXP Semiconductors' LPC2138FBD64/01,15 is a 32-bit ARM7 microcontroller with 3.3V power supply, 25MHz clock frequency, and 32768 bytes of RAM. It features DAC and ADC channels for analog functions and offers flash ROM programmability. Ideal for industrial applications requiring a compact form factor with low profile packaging.

Median Price

$16.185

Lifecycle Status

Suppliers In-Stock

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In-Stock Inventory

1k+

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DigiKey

USA . 178 parts In-Stock

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$14.240

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Flip Electronics (Authorized)

USA . 178 parts In-Stock

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Verical

USA . 178 parts In-Stock

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$18.130

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Distributors (In-Stock)

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Nova Conductors

Japan . 900 parts In-Stock

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$11.410

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$11.410

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Component Electronics Inc.

Canada . 4 parts In-Stock

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$24.620

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$18.460

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$16.000

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$24.620

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Vyrian

USA . 7,351 parts In-Stock

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Anansix

USA . 695 parts In-Stock

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695

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Sensible Micro Corp

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480

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Digiode

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ComSIT USA

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ComSIT Distribution GmbH

Germany . 360 parts In-Stock

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Flip Electronics

USA . 178 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 17 parts In-Stock

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Speed Components Ltd

Israel . 10 parts In-Stock

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Distributors (Availability)

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Benley Electronics

USA . 320 parts In-Stock

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$4.250

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$4.250

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Continental Prestige Electronics

USA . 5,074 parts In-Stock

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$11.410

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$11.182

5,074

$11.410

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$11.182

Netroflash

USA . 500 parts In-Stock

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$11.410

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$11.410

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Semicontronic

India . 344 parts In-Stock

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$12.100

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$11.798

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$11.737

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344

$12.100

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$11.737

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Ampacity Inc.

Singapore . 178 parts In-Stock

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AZTECH Wire

Italy . 252 parts In-Stock

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$16.058

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Microchip USA

USA . 1,346 parts In-Stock

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$28.811

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Advanced Electronics

New Zealand . 6,000 parts In-Stock

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$29.780

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$28.291

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Aztec Data Supply Inc.

USA . 4,996 parts In-Stock

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$61.930

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Corohmni

South Africa . 1,299 parts In-Stock

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Perfect Parts

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Lixinc

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A-Z Elektronik GmbH

Germany . 6,866 parts In-Stock

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S.R.D Solutions

India . 4,000 parts In-Stock

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Argo Parts USA

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Corphita

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Infinite Electronics LLP (Excess)

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UNI Independent Distributors

Spain . 401 parts In-Stock

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Futuretech Components

Singapore . 400 parts In-Stock

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iodParts Technologies Inc.

India . 48 parts In-Stock

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Overview

Unlock the power of innovation with the LPC2138FBD64/01,15 microcontroller by NXP Semiconductors. Crafted with precision and expertise, this cutting-edge device is perfect for a wide range of applications, offering unmatched quality and reliability. Seamlessly integrate this versatile microcontroller into your projects to experience enhanced performance, efficient operation, and endless possibilities. Embrace the future of technology with the LPC2138FBD64/01,15 and revolutionize your creations today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making this product suitable for a variety of applications.

Surface Mount: YES

Being surface mountable makes installation and PCB assembly easier and more efficient, reducing overall production time and costs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller is suitable for low-power applications while still providing sufficient voltage for optimal performance.

Address Bus Width: 8

An address bus width of 8 allows for efficient memory addressing and data transfer, enabling faster processing speeds and improved performance.

Package Shape: SQUARE

The square package shape is compact and space-saving, making it ideal for designs where size constraints are a consideration.

Bit Size: 32

With a bit size of 32, this microcontroller can handle larger data sizes and complex calculations, making it suitable for a wide range of applications that require high processing power.

DAC Channels: YES

The presence of DAC channels allows for analog signal generation, making this microcontroller versatile and suitable for applications that require precise analog outputs.

Power Supplies (V): 3.3

With a nominal supply voltage of 3.3V, this microcontroller offers low power consumption while still delivering reliable performance, making it an energy-efficient choice.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for interfacing with external devices and peripherals, enhancing the versatility and functionality of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style allows for a compact footprint and easy integration into tight spaces, making it ideal for applications with size constraints.

Minimum Supply Voltage: 3 V

With a minimum supply voltage of 3V, this microcontroller is capable of operating reliably even at lower voltages, ensuring consistent performance across varying power inputs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C enhances the reliability and durability of the microcontroller, allowing it to withstand harsh environmental conditions.

CPU Family: ARM7

Based on the popular ARM7 CPU architecture, this microcontroller offers efficient processing capabilities, broad software support, and compatibility with a wide range of development tools.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation in cold environments, making this microcontroller suitable for a variety of temperature conditions.

Terminal Finish: TIN

The terminal finish of TIN provides corrosion resistance and ensures reliable electrical connections, enhancing the longevity and performance of the microcontroller.

ADC Channels: YES

With ADC channels available, this microcontroller can accurately convert analog signals into digital data, making it suitable for applications that require analog input processing.

Terminal Position: QUAD

The quad terminal position offers multiple connection points in a compact layout, allowing for efficient signal routing and easy integration into PCB designs.

ROM Words: 524288

With a ROM capacity of 524,288 words, this microcontroller can store a large amount of program data and instructions, enabling complex applications and extensive software functionality.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm allows for a slim profile and compact design, making this microcontroller suitable for space-constrained applications.

Width: 10 mm

The compact width of 10mm makes this microcontroller easy to integrate into tight spaces, enabling versatile and efficient PCB layouts.

External Data Bus Width: 8

An external data bus width of 8 enables efficient data transfer between the microcontroller and external memory or peripherals, enhancing overall system performance.

Maximum Clock Frequency: 25 MHz

With a maximum clock frequency of 25MHz, this microcontroller can achieve high-speed operation and fast processing, making it suitable for applications that demand real-time performance.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and reliability during assembly processes, enhancing the overall quality and durability of the product.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this microcontroller can withstand high-temperature soldering processes, ensuring proper assembly and reliable connections.

Length: 10 mm

The compact length of 10mm makes this microcontroller suitable for space-constrained designs, allowing for efficient PCB layouts and versatile integration.

Temperature Grade: INDUSTRIAL

Designed to meet industrial-grade standards, this microcontroller is capable of operating reliably in harsh environmental conditions, making it suitable for industrial automation and control applications.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC-based microcontroller, this product offers efficient and streamlined processing capabilities, enabling fast execution of instructions and high performance in a variety of applications.

RAM Bytes: 32768

With a RAM capacity of 32,768 bytes, this microcontroller can store and access data quickly, enabling efficient data processing and multitasking capabilities.

Technology: CMOS

Based on CMOS technology, this microcontroller offers low power consumption, high noise immunity, and stable performance, making it suitable for a wide range of battery-powered and portable devices.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical and electrical connections, ensuring reliable performance and ease of soldering during manufacturing processes.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3V, this microcontroller offers stable and consistent power delivery, enhancing overall performance and reliability in various applications.

PWM Channels: YES

Having PWM channels allows for precise control of digital signals and effective modulation of output signals, making this microcontroller suitable for applications that require accurate signal manipulation and control.

ROM Programmability: FLASH

With flash programmability, this microcontroller allows for easy reprogramming of code and data without the need for external programming equipment, enabling quick updates and modifications in the field.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density mounting and space-efficient PCB layouts, making this microcontroller ideal for compact and miniaturized designs.

Speed: 60 rpm

With a speed of 60 revolutions per minute, this microcontroller can process data and execute instructions at a fast pace, making it suitable for real-time control and monitoring applications.

No. of I/O Lines: 47

Having 47 I/O lines provides ample connectivity options for interfacing with external devices and peripherals, enabling versatile communication and control capabilities in various applications.

Technical Specifications

Microcontrollers LPC2138FBD64/01,15 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

8

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

47

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LPC2138FBD64/01,15 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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