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LPC810M021FN8,129

NXP Semiconductors

LPC810M021FN8,129 by NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Voltage: 3.6 V;

Median Price

$1.560

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,654 parts In-Stock

1+ parts

$1.560

100+ parts

$1.530

1k+ parts

$1.500

10k+ parts

-

3,654

$1.560

$1.530

$1.500

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 774 parts In-Stock

1+ parts

$1.758

100+ parts

-

1k+ parts

-

10k+ parts

-

774

$1.758

-

-

-

Vyrian

USA . 4,125 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,125

-

-

-

-

Anansix

USA . 2,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,520

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,815 parts In-Stock

1+ parts

$1.665

100+ parts

-

1k+ parts

-

10k+ parts

-

1,815

$1.665

-

-

-

Vigor

Singapore . 3,654 parts In-Stock

1+ parts

$1.700

100+ parts

-

1k+ parts

-

10k+ parts

-

3,654

$1.700

-

-

-

AZTECH Wire

Italy . 942 parts In-Stock

1+ parts

$18.060

100+ parts

-

1k+ parts

-

10k+ parts

-

942

$18.060

-

-

-

UNI Independent Distributors

Spain . 6,707 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,707

-

-

-

-

Microchip USA

USA . 3,895 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,895

-

-

-

-

Technical Specifications

Microcontrollers LPC810M021FN8,129 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T8

Length:

9.5 mm

No. of I/O Lines:

6

No. of Terminals:

8

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

ROM Programmability:

FLASH

Maximum Seated Height:

4.2 mm

Speed:

30 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Technology:

CMOS

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

LPC810M021FN8,129 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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