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LPC824M201JHI33E

NXP Semiconductors

LPC824M201JHI33E by NXP Semiconductors

NXP Semiconductors' LPC824M201JHI33E is a 32-bit microcontroller with 12-Ch 12-Bit ADC channels, 8192 bytes of RAM, and max clock frequency of 25 MHz. Ideal for industrial applications, it offers connectivity through I2C(4), SPI(2), USART(3) interfaces and features peripherals like BOD, CRC, DMA(18), PMU.

Median Price

$1.236

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Verical

USA . 9,800 parts In-Stock

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$1.236

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Nova Conductors

Japan . 63 parts In-Stock

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$0.960

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Vyrian

USA . 2,956 parts In-Stock

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Anansix

USA . 2,796 parts In-Stock

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Digiode

USA . 2,533 parts In-Stock

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Chip Stock

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Flip Electronics

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Bristol Electronics

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Lantek

USA . 28 parts In-Stock

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Prism Electronics

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Elcom Components

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Continental Prestige Electronics

USA . 6,996 parts In-Stock

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$0.960

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$0.941

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Argo Parts USA

USA . 1,430 parts In-Stock

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$0.960

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Bastille Electronics

Australia . 61 parts In-Stock

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$0.960

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$0.912

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$0.866

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$0.854

61

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$0.912

$0.866

$0.854

Corohmni

South Africa . 30 parts In-Stock

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$0.960

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$0.989

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$0.939

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$0.939

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200

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Component Stockers USA

USA . 5 parts In-Stock

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$1.270

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Ampacity Inc.

Singapore . 1,611 parts In-Stock

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AZTECH Wire

Italy . 615 parts In-Stock

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Microchip USA

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Semicontronic

India . 1,107 parts In-Stock

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$20.475

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$20.370

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One Stop Electronics

USA . 565 parts In-Stock

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$24.000

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Aztec Data Supply Inc.

USA . 105 parts In-Stock

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Perfect Parts

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Lixinc

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Corphita

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GreenTree Electronics

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iodParts Technologies Inc.

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Overview

Unlock a world of endless possibilities with the LPC824M201JHI33E microcontroller by NXP Semiconductors. Crafted with precision and expertise, this powerful device offers unparalleled performance for a wide range of applications. From smart home devices to industrial automation, this versatile microcontroller delivers exceptional value, efficiency, and reliability. Experience seamless connectivity, advanced features, and robust functionality with the LPC824M201JHI33E. Revolutionize your projects and bring your ideas to life with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and commonly used in electronic components, ensuring the product's longevity and reliability.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of potential power sources, making the product versatile and compatible with various systems.

Bit Size: 32

A high bit size allows for complex computations and multitasking capabilities, making the product suitable for advanced applications.

RAM Bytes: 8192

A large RAM capacity enables the product to handle and store a significant amount of data efficiently, improving overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the product's efficiency and reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

A RISC microcontroller architecture allows for streamlined and efficient processing, making the product ideal for high-speed applications.

Connectivity: I2C(4), SPI(2), USART(3)

Multiple connectivity options provide flexibility in interfacing with different devices and systems, enhancing the product's versatility.

Technical Specifications

Microcontrollers LPC824M201JHI33E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

SEATED HGT-NOM

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N33

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

29

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.85 mm

Speed:

30 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(4), SPI(2), USART(3)

Peripherals:

BOD, COMPARATOR, CRC, DMA(18), MRT(4), PMU, POR, PWM, WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

LPC824M201JHI33E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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