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S912ZVML31F1MKF

NXP Semiconductors

S912ZVML31F1MKF by NXP Semiconductors

MICROCONTROLLER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;

Median Price

$4.000

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 10 parts In-Stock

1+ parts

$4.170

100+ parts

$4.020

1k+ parts

$3.850

10k+ parts

-

10

$4.170

$4.020

$3.850

-

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.829

10,000

-

-

-

$3.829

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,449 parts In-Stock

1+ parts

$5.339

100+ parts

-

1k+ parts

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10k+ parts

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1,449

$5.339

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-

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Nova Conductors

Japan . 47 parts In-Stock

1+ parts

$6.567

100+ parts

-

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47

$6.567

-

-

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Anansix

USA . 71 parts In-Stock

1+ parts

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71

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Vyrian

USA . 10 parts In-Stock

1+ parts

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10

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IBS Electronics

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$5.265

1k+ parts

$5.044

10k+ parts

-

10

-

$5.265

$5.044

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10 parts In-Stock

1+ parts

$4.780

100+ parts

-

1k+ parts

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10

$4.780

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Corphita

USA . 2,049 parts In-Stock

1+ parts

$5.058

100+ parts

-

1k+ parts

-

10k+ parts

-

2,049

$5.058

-

-

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Continental Prestige Electronics

USA . 2,780 parts In-Stock

1+ parts

$6.567

100+ parts

-

1k+ parts

-

10k+ parts

$6.435

2,780

$6.567

-

-

$6.435

Netroflash

USA . 100 parts In-Stock

1+ parts

$6.567

100+ parts

-

1k+ parts

$6.238

10k+ parts

$6.107

100

$6.567

-

$6.238

$6.107

Vigor

Singapore . 5,000 parts In-Stock

1+ parts

$8.390

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

$8.390

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Microchip USA

USA . 2,246 parts In-Stock

1+ parts

$16.010

100+ parts

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2,246

$16.010

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AZTECH Wire

Italy . 461 parts In-Stock

1+ parts

$17.228

100+ parts

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461

$17.228

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Lixinc

USA . 18,492 parts In-Stock

1+ parts

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18,492

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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UNI Independent Distributors

Spain . 2,258 parts In-Stock

1+ parts

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2,258

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A-Z Elektronik GmbH

Germany . 1,650 parts In-Stock

1+ parts

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1,650

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Argo Parts USA

USA . 217 parts In-Stock

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217

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Kepictronics

USA . 161 parts In-Stock

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161

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Technical Specifications

Microcontrollers S912ZVML31F1MKF attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

S912ZVML31F1MKF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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