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SPC5777CDK3MMO4R

NXP Semiconductors

SPC5777CDK3MMO4R by NXP Semiconductors

NXP Semiconductors' SPC5777CDK3MMO4R is a 32-bit microcontroller with 516 terminals, operating at a max clock frequency of 40 MHz. It features ADC and DMA channels, PWM support, and a RISC architecture. This square-shaped microcontroller with grid array packaging is suitable for applications requiring high-speed processing and precise control in automotive electronics.

Median Price

$53.714

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 10,000 parts In-Stock

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$53.714

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Distributors (In-Stock)

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Nova Conductors

Japan . 54 parts In-Stock

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$44.436

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Vyrian

USA . 7,840 parts In-Stock

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Anansix

USA . 2,322 parts In-Stock

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Digiode

USA . 781 parts In-Stock

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781

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Distributors (Availability)

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AZTECH Wire

Italy . 748 parts In-Stock

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$18.864

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One Stop Electronics

USA . 148 parts In-Stock

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$23.000

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Ampacity Inc.

Singapore . 849 parts In-Stock

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$24.000

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Netroflash

USA . 500 parts In-Stock

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$44.436

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$42.214

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$41.325

500

$44.436

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$42.214

$41.325

Continental Prestige Electronics

USA . 199 parts In-Stock

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$44.436

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$43.547

199

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Aztec Data Supply Inc.

USA . 4,960 parts In-Stock

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$70.900

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Corohmni

South Africa . 457 parts In-Stock

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$72.270

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Microchip USA

USA . 2,405 parts In-Stock

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Authorized Procurement Solutions

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UNI Independent Distributors

Spain . 2,355 parts In-Stock

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Corphita

USA . 1,267 parts In-Stock

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Argo Parts USA

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Overview

Discover the cutting-edge SPC5777CDK3MMO4R by NXP Semiconductors, a top-tier microcontroller designed to revolutionize your projects. With NXP's reputation for excellence in semiconductor manufacturing, this powerhouse device offers unparalleled performance and reliability. Ideal for a wide range of applications, from automotive to industrial automation, this microcontroller boasts advanced features like ADC and DMA channels, ensuring seamless operation. Elevate your designs with the SPC5777CDK3MMO4R and experience the innovation and precision that only NXP Semiconductors can deliver.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, making this microcontroller a suitable choice for mass production.

Maximum Supply Voltage: 1.32 V

With a high maximum supply voltage, this microcontroller can handle a wide range of input voltages, providing flexibility in design.

Package Shape: SQUARE

The square package shape allows for easier placement on the PCB and efficient use of board space.

Bit Size: 32

A 32-bit architecture offers higher performance and processing capabilities compared to lower bit sizes.

No. of Terminals: 516

Having a large number of terminals provides extensive connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY

Grid array packaging offers enhanced thermal performance and reliability, making it ideal for applications that require high durability.

Minimum Supply Voltage: 1.2 V

With a low minimum supply voltage, this microcontroller is suitable for applications requiring low power consumption or operating on battery power.

Terminal Finish: TIN SILVER

The tin silver terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

ADC Channels: YES

Having ADC channels allows for analog-to-digital conversion, enabling the microcontroller to interface with sensors and other analog devices.

DMA Channels: YES

Direct Memory Access (DMA) channels enhance data transfer speed and efficiency, making this microcontroller suitable for real-time data processing applications.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies the PCB layout and routing, facilitating easier and more compact designs.

Width: 27 mm

A compact width dimension enables space-saving PCB designs, making this microcontroller suitable for applications with size constraints.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency allows for fast processing and high-speed operation, making this microcontroller suitable for performance-critical applications.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum reflow time of 40 seconds ensures proper soldering and reliability during assembly, making this microcontroller suitable for high-volume production.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this microcontroller can withstand the soldering process without degrading performance or reliability.

Length: 27 mm

A compact length dimension allows for space-efficient PCB layouts and smaller overall product sizes.

Peripheral IC Type: MICROCONTROLLER, RISC

A RISC-based microcontroller architecture offers high performance and efficiency, making this product suitable for a wide range of applications.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and reliable connections, ensuring a robust electrical interface.

PWM Channels: YES

Pulse Width Modulation (PWM) channels provide precise control over outputs, making this microcontroller ideal for applications requiring motor control or dimming functions.

Terminal Pitch: 1 mm

A narrow terminal pitch enables high-density PCB designs, allowing for more components to be packed in a limited space.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate moisture sensitivity, requiring standard handling and storage procedures to maintain component integrity.

Speed: 264 rpm

With a high speed rating, this microcontroller is suitable for applications requiring fast and responsive control or processing capabilities.

Technical Specifications

Microcontrollers SPC5777CDK3MMO4R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e2

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

516

PWM Channels:

YES

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Speed:

264 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Trade Compliance

SPC5777CDK3MMO4R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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