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SPC5777CDK3MME4

NXP Semiconductors

SPC5777CDK3MME4 by NXP Semiconductors

NXP Semiconductors' SPC5777CDK3MME4 microcontroller features 32-bit architecture, 40 MHz clock frequency, and 416 terminals in a square package. Ideal for applications requiring ADC and DMA channels, with a peak reflow temperature of 260°C.

Median Price

$60.450

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 195 parts In-Stock

1+ parts

$56.740

100+ parts

$49.210

1k+ parts

-

10k+ parts

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195

$56.740

$49.210

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Verical

USA . 195 parts In-Stock

1+ parts

$56.740

100+ parts

$49.210

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-

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195

$56.740

$49.210

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Chip1Stop

Japan . 80 parts In-Stock

1+ parts

$64.160

100+ parts

-

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80

$64.160

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DigiKey

USA . 52 parts In-Stock

1+ parts

$84.220

100+ parts

$66.564

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52

$84.220

$66.564

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Mouser Electronics

USA . 80 parts In-Stock

1+ parts

$88.570

100+ parts

$65.760

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-

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80

$88.570

$65.760

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Avnet

USA . 80 parts In-Stock

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80

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Rochester

USA . 5 parts In-Stock

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-

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$53.240

1k+ parts

$47.630

10k+ parts

$44.830

5

-

$53.240

$47.630

$44.830

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 382 parts In-Stock

1+ parts

$46.826

100+ parts

-

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382

$46.826

-

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Nova Conductors

Japan . 86 parts In-Stock

1+ parts

$56.080

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86

$56.080

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Vyrian

USA . 7,548 parts In-Stock

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7,548

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Anansix

USA . 1,162 parts In-Stock

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TME

Poland . 80 parts In-Stock

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$70.980

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80

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$70.980

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 298 parts In-Stock

1+ parts

$9.624

100+ parts

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298

$9.624

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Corohmni

South Africa . 115 parts In-Stock

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$33.268

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115

$33.268

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Ampacity Inc.

Singapore . 80 parts In-Stock

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$41.900

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80

$41.900

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Corphita

USA . 1,971 parts In-Stock

1+ parts

$44.361

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1,971

$44.361

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Netroflash

USA . 1,000 parts In-Stock

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$56.080

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1,000

$56.080

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Microchip USA

USA . 1,561 parts In-Stock

1+ parts

$157.900

100+ parts

$155.150

1k+ parts

$153.780

10k+ parts

$152.400

1,561

$157.900

$155.150

$153.780

$152.400

Lixinc

USA . 13,645 parts In-Stock

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13,645

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UNI Independent Distributors

Spain . 3,903 parts In-Stock

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3,903

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A-Z Elektronik GmbH

Germany . 3,420 parts In-Stock

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Continental Prestige Electronics

USA . 3,210 parts In-Stock

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3,210

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Argo Parts USA

USA . 259 parts In-Stock

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259

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Overview

Discover the cutting-edge SPC5777CDK3MME4 microcontroller by NXP Semiconductors, a top-tier manufacturer renowned for delivering high-quality components. This versatile device offers unparalleled performance and reliability in various applications, thanks to its advanced features like ADC and DMA channels. With a maximum clock frequency of 40 MHz and a 32-bit size, this microcontroller is perfect for powering your next project with efficiency and precision. Elevate your designs with the SPC5777CDK3MME4 and experience the value and benefits it brings to your creations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes it easy to mount the microcontroller on a PCB, saving space and allowing for automated assembly.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage ensures reliable operation even under fluctuating voltage conditions.

Package Shape: SQUARE

Square package shape makes it easier to place the microcontroller on the PCB and optimize space efficiency.

Bit Size: 32

32-bit architecture provides enhanced processing power and capability for complex applications.

No. of Terminals: 416

High number of terminals allows for versatile connectivity options and integration with other components.

Package Style (Meter): GRID ARRAY

Grid array package style offers better solder joint reliability and mechanical strength for rugged applications.

Minimum Supply Voltage: 1.2 V

Low minimum supply voltage enables efficient power management and extends battery life in portable devices.

Terminal Finish: TIN SILVER

Tin silver terminal finish provides good solderability and corrosion resistance for reliable connections.

ADC Channels: YES

Built-in ADC channels allow for analog signal processing and sensor interfacing without the need for additional components.

DMA Channels: YES

DMA channels enable high-speed data transfer between peripherals and memory, improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout design and heat dissipation for optimal performance.

Width: 27 mm

Compact width simplifies PCB integration and allows for space-efficient design in constrained applications.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency provides fast processing speeds and responsive performance for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

Allows for sufficient time at peak reflow temperature during manufacturing process for reliable solder joints.

Peak Reflow Temperature °C: 260

Withstands high peak reflow temperature for robust soldering and assembly processes.

Length: 27 mm

Compact length ensures space-efficient PCB design and easy integration into various electronic devices.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient instruction processing and low power consumption for enhanced performance.

Terminal Form: BALL

Ball terminal form enables reliable and secure connections for stable operation in demanding environments.

PWM Channels: YES

PWM channels support precise control of digital signals for applications such as motor control and LED brightness modulation.

Terminal Pitch: 1 mm

Fine terminal pitch allows for high-density packaging and compact design without sacrificing performance.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller can withstand moderate exposure to moisture during storage and handling.

Speed: 264 rpm

High processing speed of 264 rpm ensures rapid execution of tasks and efficient performance in time-critical applications.

Technical Specifications

Microcontrollers SPC5777CDK3MME4 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e2

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

416

PWM Channels:

YES

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Speed:

264 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Trade Compliance

SPC5777CDK3MME4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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