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MC9S12DG256CFUER

NXP Semiconductors

MC9S12DG256CFUER by NXP Semiconductors

MC9S12DG256CFUER by NXP is a 16-bit microcontroller with 80 terminals, 16 MHz clock frequency, and ADC channels. Ideal for applications requiring high-speed processing and analog-to-digital conversion capabilities. Suitable for automotive, industrial control, and consumer electronics due to its robust features.

Median Price

$32.563

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,750 parts In-Stock

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$32.563

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9,750

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$32.563

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Flip Electronics (Authorized)

USA . 310 parts In-Stock

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310

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Distributors (In-Stock)

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Nova Conductors

Japan . 650 parts In-Stock

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$34.316

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650

$34.316

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Vyrian

USA . 8,615 parts In-Stock

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Digiode

USA . 2,380 parts In-Stock

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Anansix

USA . 2,143 parts In-Stock

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Flip Electronics

USA . 850 parts In-Stock

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850

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Distributors (Availability)

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AZTECH Wire

Italy . 227 parts In-Stock

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$6.203

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Ampacity Inc.

Singapore . 310 parts In-Stock

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$9.000

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310

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Semicontronic

India . 310 parts In-Stock

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$9.000

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$8.775

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$8.730

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310

$9.000

$8.775

$8.730

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Continental Prestige Electronics

USA . 2,169 parts In-Stock

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$34.316

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$33.629

2,169

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Netroflash

USA . 1,000 parts In-Stock

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$34.316

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Corohmni

South Africa . 244 parts In-Stock

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$34.399

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244

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Advanced Electronics

New Zealand . 700 parts In-Stock

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$35.002

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$35.002

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$35.002

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$35.002

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Aztec Data Supply Inc.

USA . 795 parts In-Stock

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$47.436

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$47.436

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Microchip USA

USA . 2,619 parts In-Stock

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$72.063

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Argo Parts USA

USA . 4,811 parts In-Stock

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UNI Independent Distributors

Spain . 3,208 parts In-Stock

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Corphita

USA . 388 parts In-Stock

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Overview

Experience the innovation and reliability of NXP Semiconductors with the MC9S12DG256CFUER microcontroller. Designed for a wide range of applications, this high-quality product offers customers exceptional value and benefits. With features like ADC channels, PWM channels, and 59 I/O lines, this microcontroller delivers top-notch performance. Trust NXP Semiconductors for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation on a PCB, saving space and simplifying assembly process.

Maximum Supply Voltage: 2.75 V

Suitable for low power applications, ensuring efficient performance and longer battery life.

Address Bus Width: 16

Allows for efficient data processing and memory access in complex applications.

Package Shape: SQUARE

Provides a compact form factor, optimizing board space usage.

Bit Size: 16

Offers sufficient computational power for a wide range of applications.

No. of Terminals: 80

Provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK

Ensures efficient heat dissipation and easy integration into the overall system.

Minimum Supply Voltage: 2.35 V

Allows for operation in low voltage conditions, enhancing versatility.

ADC Channels: YES

Enables analog to digital conversion for sensor interfacing and data acquisition.

Terminal Position: QUAD

Facilitates easy soldering and PCB layout, enhancing manufacturability.

Width: 14 mm

Compact size makes it suitable for applications with space constraints.

External Data Bus Width: 16

Efficient data transfer capability for demanding applications.

Maximum Clock Frequency: 16 MHz

Provides high processing speed for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures reliable soldering process during assembly.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during soldering without damage.

Length: 14 mm

Compact form factor for space-constrained applications.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for control and processing tasks, making it a suitable choice for embedded systems.

Terminal Form: GULL WING

Facilitates easy soldering and inspection during manufacturing process.

Nominal Supply Voltage: 2.5 V

Optimal voltage level for stable and efficient operation.

PWM Channels: YES

Enables pulse-width modulation for precise control in motor and other applications.

Terminal Pitch: 0.65 mm

Allows for fine pitch soldering, suitable for compact PCB designs.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture, ensuring reliability in harsh environments.

Speed: 25 rpm

Provides sufficient processing speed for a variety of applications.

No. of I/O Lines: 59

Plenty of input/output options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MC9S12DG256CFUER attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DMA Channels:

NO

External Data Bus Width:

16

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

59

No. of Terminals:

80

PWM Channels:

YES

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Speed:

25 rpm

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MC9S12DG256CFUER Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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