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S9S12G192F0VLFR

NXP Semiconductors

S9S12G192F0VLFR by NXP Semiconductors

NXP Semiconductors' S9S12G192F0VLFR microcontroller features 16-bit size, 48 terminals, and 5.5V max supply voltage. Ideal for applications requiring a max clock frequency of 16MHz, with PWM channels and ADC support.

Median Price

$5.992

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$5.843

10,000

-

-

-

$5.843

Rochester

USA . 726 parts In-Stock

1+ parts

-

100+ parts

$6.140

1k+ parts

$5.490

10k+ parts

$5.170

726

-

$6.140

$5.490

$5.170

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,198 parts In-Stock

1+ parts

$4.912

100+ parts

-

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1,198

$4.912

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Vyrian

USA . 8,416 parts In-Stock

1+ parts

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8,416

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Chip Stock

USA . 2,900 parts In-Stock

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2,900

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Anansix

USA . 1,858 parts In-Stock

1+ parts

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1,858

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Flip Electronics

USA . 750 parts In-Stock

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750

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Nova Conductors

Japan . 41 parts In-Stock

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41

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 676 parts In-Stock

1+ parts

$4.390

100+ parts

-

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676

$4.390

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Corphita

USA . 3,475 parts In-Stock

1+ parts

$4.653

100+ parts

-

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3,475

$4.653

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Vigor

Singapore . 9,244 parts In-Stock

1+ parts

$7.700

100+ parts

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9,244

$7.700

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AZTECH Wire

Italy . 263 parts In-Stock

1+ parts

$9.010

100+ parts

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263

$9.010

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Microchip USA

USA . 4,668 parts In-Stock

1+ parts

$14.861

100+ parts

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4,668

$14.861

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Corohmni

South Africa . 722 parts In-Stock

1+ parts

$76.306

100+ parts

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722

$76.306

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QUARKTWIN TECHNOLOGY LTD

USA . 22,248 parts In-Stock

1+ parts

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22,248

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UNI Independent Distributors

Spain . 5,038 parts In-Stock

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5,038

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Overview

Unleash the power of innovation with the S9S12G192F0VLFR microcontroller by NXP Semiconductors. This cutting-edge device offers unparalleled quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications, this microcontroller delivers exceptional value, benefits, and advantages to customers seeking top-notch performance and efficiency. Elevate your projects to new heights with the S9S12G192F0VLFR and experience the difference that superior technology can make in your designs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, making this microcontroller suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources, making it versatile for different projects.

Package Shape: SQUARE

The square package shape provides uniformity and ease of design when placing the microcontroller on the PCB.

Bit Size: 16

A 16-bit architecture allows for more precise calculations and data processing compared to lower-bit microcontrollers.

No. of Terminals: 48

Having a higher number of terminals provides more flexibility in connecting external components and peripherals to the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low profile style saves space on the PCB and reduces the overall height of the assembly, ideal for slim devices.

Minimum Supply Voltage: 3.13 V

The low minimum supply voltage allows for efficient power consumption and operation in low-power applications.

Terminal Finish: TIN

The TIN terminal finish provides good conductivity and solderability for reliable connections on the PCB.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its range of applications.

Terminal Position: QUAD

The quad terminal position simplifies the layout and routing of connections on the PCB, enhancing ease of assembly.

Width: 7 mm

The compact width of 7mm saves valuable space on the PCB, especially in designs where space is limited.

Maximum Clock Frequency: 16 MHz

A high maximum clock frequency of 16MHz allows for fast processing and response times, suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

With the ability to withstand reflow temperatures for up to 40 seconds, this microcontroller is durable and reliable during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and durability of the connections during assembly.

Length: 7 mm

The small length of 7mm contributes to the overall compactness and space-saving design of the microcontroller.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with integrated peripherals, it offers comprehensive functionality in a single package, reducing the need for additional external components.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and reliability in solder joints, ensuring robust connections on the PCB.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a standard in many electronic systems, making this microcontroller compatible with a wide range of devices.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of analog signals, making this microcontroller suitable for applications requiring accurate voltage regulation.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density mounting on the PCB, maximizing the use of available space.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, this microcontroller can withstand moderate exposure to moisture during storage and handling, enhancing its reliability in various environments.

Speed: 25 rpm

A speed of 25 rpm is suitable for controlling motors and actuators, making this microcontroller ideal for automation and robotics applications.

No. of I/O Lines: 40

Having 40 I/O lines allows for versatile input and output configurations, enabling the microcontroller to interface with a wide range of external devices and sensors.

Technical Specifications

Microcontrollers S9S12G192F0VLFR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DMA Channels:

NO

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Speed:

25 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

S9S12G192F0VLFR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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