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S9S12ZVL32F0MLFR

NXP Semiconductors

S9S12ZVL32F0MLFR by NXP Semiconductors

MICROCONTROLLER; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40;

Median Price

$4.270

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$4.270

100+ parts

-

1k+ parts

-

10k+ parts

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900

$4.270

-

-

-

Digiode

USA . 4,725 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,725

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-

-

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Vyrian

USA . 2,619 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,619

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-

-

-

Anansix

USA . 174 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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174

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,797 parts In-Stock

1+ parts

$4.270

100+ parts

-

1k+ parts

-

10k+ parts

$4.185

5,797

$4.270

-

-

$4.185

Argo Parts USA

USA . 4,205 parts In-Stock

1+ parts

$4.270

100+ parts

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1k+ parts

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4,205

$4.270

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Vigor

Singapore . 3,000 parts In-Stock

1+ parts

$4.565

100+ parts

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1k+ parts

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10k+ parts

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3,000

$4.565

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Corohmni

South Africa . 351 parts In-Stock

1+ parts

$4.630

100+ parts

-

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10k+ parts

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351

$4.630

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One Stop Electronics

USA . 785 parts In-Stock

1+ parts

$12.000

100+ parts

-

1k+ parts

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10k+ parts

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785

$12.000

-

-

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AZTECH Wire

Italy . 248 parts In-Stock

1+ parts

$14.599

100+ parts

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248

$14.599

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Ampacity Inc.

Singapore . 1,285 parts In-Stock

1+ parts

$17.000

100+ parts

-

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10k+ parts

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1,285

$17.000

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Semicontronic

India . 1,007 parts In-Stock

1+ parts

$17.000

100+ parts

$16.575

1k+ parts

$16.490

10k+ parts

-

1,007

$17.000

$16.575

$16.490

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Microchip USA

USA . 3,590 parts In-Stock

1+ parts

$24.130

100+ parts

$23.980

1k+ parts

$23.910

10k+ parts

$23.830

3,590

$24.130

$23.980

$23.910

$23.830

Aztec Data Supply Inc.

USA . 2,908 parts In-Stock

1+ parts

$43.443

100+ parts

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1k+ parts

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10k+ parts

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2,908

$43.443

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Perfect Parts

USA . 483,186 parts In-Stock

1+ parts

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483,186

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

1+ parts

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20,000

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Lixinc

USA . 13,240 parts In-Stock

1+ parts

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13,240

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Epart123

USA . 6,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

$108.000

6,000

-

-

-

$108.000

UNI Independent Distributors

Spain . 3,366 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,366

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-

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Corphita

USA . 2,549 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,549

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Futuretech Components

Singapore . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

-

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$4.185

1k+ parts

$4.056

10k+ parts

$3.971

1,000

-

$4.185

$4.056

$3.971

Technical Specifications

Microcontrollers S9S12ZVL32F0MLFR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

S9S12ZVL32F0MLFR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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