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MC9S12DG128CPVER

NXP Semiconductors

MC9S12DG128CPVER by NXP Semiconductors

MC9S12DG128CPVER by NXP Semiconductors is a 16-bit microcontroller with 131072 ROM words, 8192 RAM bytes, and 16-Ch 10-Bit ADC channels. It is ideal for industrial applications requiring CAN(2), I2C(2), SCI(2), SPI(2) connectivity and features PWM(8) and TIMER(8) peripherals.

Median Price

$27.031

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Verical

USA . 10,000 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Vyrian

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Chip Stock

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Anansix

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Ampacity Inc.

Singapore . 413 parts In-Stock

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AZTECH Wire

Italy . 861 parts In-Stock

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Corohmni

South Africa . 386 parts In-Stock

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Continental Prestige Electronics

USA . 3,562 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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Modulus Dynamics

Lithuania . 89 parts In-Stock

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$26.731

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$26.464

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$25.662

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Semicontronic

India . 145 parts In-Stock

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$30.225

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Aztec Data Supply Inc.

USA . 1,555 parts In-Stock

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Microchip USA

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Argo Parts USA

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Overview

Enhance your electronic designs with the MC9S12DG128CPVER microcontroller by NXP Semiconductors. Known for their high-quality products, NXP delivers reliability and innovation in every component. This microcontroller is perfect for a wide range of applications, offering advanced features such as 16-bit data bus width and 8 timers. With its compact design and low profile package style, the MC9S12DG128CPVER provides exceptional value and performance to customers looking to elevate their projects to the next level. Explore the possibilities with NXP Semiconductors and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 2.75 V

A higher maximum supply voltage provides flexibility in power supply options for different applications.

On Chip Data RAM Width: 8

The wide on-chip data RAM width allows for efficient data processing and storage.

Address Bus Width: 16

The 16-bit address bus width allows for larger memory address space and more complex calculations.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures high quality and reliability for automotive applications.

Package Shape: SQUARE

The square package shape makes it easier to mount and integrate into compact designs.

Bit Size: 16

The 16-bit architecture provides higher computational power and precision.

No. of Terminals: 112

With 112 terminals, this microcontroller offers ample connectivity options for various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low profile package style saves space and enables slim device designs.

Minimum Supply Voltage: 2.35 V

The lower minimum supply voltage helps in reducing power consumption for energy-efficient operation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures robust performance even in harsh environments.

CPU Family: MC9S12D

Being part of the MC9S12D CPU family ensures compatibility and familiarity for developers.

Minimum Operating Temperature: -40 °C

The wide operating temperature range enables this microcontroller to function in extreme cold conditions.

ADC Channels: YES

The presence of ADC channels allows for analog-to-digital conversion, enabling sensor interfacing and signal processing.

Terminal Position: QUAD

The quad terminal position makes it easy to connect and interface with external components in a compact space.

ROM Words: 131072

With 131072 ROM words, this microcontroller offers ample memory for storing program instructions.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for slim and compact device designs.

Width: 20 mm

The compact width dimension makes it suitable for space-constrained applications.

Data EEPROM Size: 2K

The 2K data EEPROM size provides non-volatile memory storage for critical data retention.

External Data Bus Width: 16

The wide external data bus width allows for fast data transfer between the microcontroller and external devices.

Peripherals: PWM(8), TIMER(8)

The presence of 8 PWM and 8 timer peripherals expands functionality and adds versatility to the microcontroller.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency enables fast processing speeds and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 40

The 40-second maximum time at peak reflow temperature ensures reliable soldering during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures stable performance during assembly processes.

Length: 20 mm

The compact length dimension makes it suitable for space-constrained designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in demanding industrial environments.

Peripheral IC Type: MICROCONTROLLER

The microcontroller type indicates its primary function and suitability for various applications.

No. of Timers: 8

With 8 timers, this microcontroller provides precise timing control for different functions.

RAM Bytes: 8192

The 8192 RAM bytes offer ample memory for data storage and manipulation during operation.

Technology: CMOS

The CMOS technology ensures low power consumption and efficient operation.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during assembly.

Analog To Digital Convertors: 16-Ch 10-Bit

The 16-channel 10-bit ADC converters enable multiple analog signal inputs and precise digital conversion.

Maximum Supply Current: 55 mA

The maximum supply current of 55 mA indicates low power consumption for efficient energy usage.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V ensures stable and consistent power input for operation.

PWM Channels: YES

The presence of PWM channels allows for precise control of pulse-width modulation output signals.

Connectivity: CAN(2), I2C(2), SCI(2), SPI(2)

The multiple connectivity options including CAN, I2C, SCI, and SPI interfaces enable versatile communication with external devices.

ROM Programmability: FLASH

The FLASH ROM programmability feature allows for easy and fast reprogramming of the microcontroller.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for dense packing and high pin count in compact designs.

Format: FIXED POINT

The fixed-point format ensures accuracy in numerical calculations and processing.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate moisture sensitivity during storage and handling.

Speed: 50 rpm

The 50 rpm speed indicates the maximum rotation per minute for time-sensitive applications.

On Chip Program ROM Width: 8

The 8-bit on-chip program ROM width offers efficient storage of program instructions on the microcontroller.

No. of I/O Lines: 93

With 93 I/O lines, this microcontroller provides ample input and output options for external communication.

Technical Specifications

Microcontrollers MC9S12DG128CPVER attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

16

Boundary Scan:

NO

CPU Family:

MC9S12D

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G112

Length:

20 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

93

No. of Terminals:

112

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP112,.87SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C(2), SCI(2), SPI(2)

Peripherals:

PWM(8), TIMER(8)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

MC9S12DG128CPVER Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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