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MC68HC11E1VFNE3R

NXP Semiconductors

MC68HC11E1VFNE3R by NXP Semiconductors

MC68HC11E1VFNE3R by NXP Semiconductors is an 8-bit microcontroller with 16-bit address bus, 5V nominal voltage, and 12MHz max clock frequency. Widely used in applications requiring ADC channels, it features a square chip carrier package style and J bend terminal form.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 40 parts In-Stock

1+ parts

$1.000

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40

$1.000

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Digiode

USA . 2,903 parts In-Stock

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2,903

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Anansix

USA . 2,702 parts In-Stock

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2,702

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Vyrian

USA . 2,186 parts In-Stock

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Flip Electronics

USA . 1,350 parts In-Stock

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1,350

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 100 parts In-Stock

1+ parts

$1.000

100+ parts

$0.980

1k+ parts

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100

$1.000

$0.980

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One Stop Electronics

USA . 680 parts In-Stock

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$3.000

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680

$3.000

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AZTECH Wire

Italy . 765 parts In-Stock

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$18.756

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765

$18.756

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Ampacity Inc.

Singapore . 773 parts In-Stock

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$21.000

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773

$21.000

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Component Stockers USA

USA . 400 parts In-Stock

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$99.990

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400

$99.990

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Microchip USA

USA . 2,601 parts In-Stock

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$136.350

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UNI Independent Distributors

Spain . 5,616 parts In-Stock

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Corphita

USA . 4,654 parts In-Stock

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Overview

Unleash the power of innovation with the MC68HC11E1VFNE3R microcontroller by NXP Semiconductors. This cutting-edge product boasts top-notch quality and reliability, making it a standout choice for a wide range of applications. From automotive to consumer electronics, this microcontroller delivers unmatched performance and efficiency. Experience seamless integration, superior functionality, and unmatched value with the MC68HC11E1VFNE3R – where innovation meets excellence.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for smaller and lighter components, making it easier to design compact and portable devices.

Maximum Supply Voltage: 5.5 V

Can operate at a relatively high voltage, providing flexibility in power supply options.

Package Shape: SQUARE

Square package shape helps in space-saving and efficient PCB layout.

Bit Size: 8

8-bit architecture allows for cost-effective and efficient processing for simpler applications.

ADC Channels: YES

Integrated Analog-to-Digital Converter (ADC) channels enable analog signal processing for various sensor and input applications.

Maximum Clock Frequency: 12 MHz

Operating at a high clock frequency allows for faster processing speeds and improved performance.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage simplifies power requirements and compatibility with other components.

Technical Specifications

Microcontrollers MC68HC11E1VFNE3R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

Maximum Clock Frequency:

12 MHz

DMA Channels:

NO

External Data Bus Width:

8

JESD-609 Code:

e3

Length:

19.125 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

52

PWM Channels:

NO

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Speed:

3 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19.125 mm

Peripheral IC Type:

Trade Compliance

MC68HC11E1VFNE3R Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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