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LPC1114FHN33/303Y

NXP Semiconductors

LPC1114FHN33/303Y by NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: NO LEAD; No. of Terminals: 33; Package Code: HVQCCN; Package Shape: SQUARE; Minimum Supply Voltage: 1.8 V;

Median Price

$2.114

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.960

10k+ parts

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4,000

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-

$1.960

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Flip Electronics (Authorized)

USA . 4,000 parts In-Stock

1+ parts

-

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4,000

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Verical

USA . 4,000 parts In-Stock

1+ parts

-

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1k+ parts

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10k+ parts

$2.268

4,000

-

-

-

$2.268

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,000

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Vyrian

USA . 3,150 parts In-Stock

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3,150

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Anansix

USA . 1,832 parts In-Stock

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1,832

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Digiode

USA . 227 parts In-Stock

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227

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$15.360

100+ parts

$13.978

1k+ parts

$12.595

10k+ parts

-

2,000

$15.360

$13.978

$12.595

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AZTECH Wire

Italy . 883 parts In-Stock

1+ parts

$21.850

100+ parts

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1k+ parts

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10k+ parts

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883

$21.850

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QUARKTWIN TECHNOLOGY LTD

USA . 16,061 parts In-Stock

1+ parts

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16,061

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Microchip USA

USA . 5,649 parts In-Stock

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5,649

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UNI Independent Distributors

Spain . 4,480 parts In-Stock

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4,480

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Corphita

USA . 1,606 parts In-Stock

1+ parts

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1,606

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Technical Specifications

Microcontrollers LPC1114FHN33/303Y attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1114FHN33/303Y Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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