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SPC5777CLK3MMO3

NXP Semiconductors

SPC5777CLK3MMO3 by NXP Semiconductors

NXP Semiconductors' SPC5777CLK3MMO3 is a 32-bit microcontroller with 8388608 ROM words and 524288 RAM bytes. It features CAN(6), DSPI(5), EBI, ETHERNET, SCI(5) connectivity and peripherals like DMA(128) and PWM. Ideal for automotive applications with an operating temperature range of -40 to 125 °C and a max clock frequency of 40 MHz.

Median Price

$46.639

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Avnet

USA . 280 parts In-Stock

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Nova Conductors

Japan . 51 parts In-Stock

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Digiode

USA . 2,911 parts In-Stock

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Anansix

USA . 1,240 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 675 parts In-Stock

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Ampacity Inc.

Singapore . 40 parts In-Stock

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$31.000

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$35.337

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$32.157

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$28.976

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Bastille Electronics

Australia . 10 parts In-Stock

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$46.640

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$44.308

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$41.510

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Vigor

Singapore . 1,050 parts In-Stock

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$75.100

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Microchip USA

USA . 1,519 parts In-Stock

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UNI Independent Distributors

Spain . 5,967 parts In-Stock

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Overview

Experience seamless performance and unparalleled reliability with the SPC5777CLK3MMO3 microcontroller by NXP Semiconductors. Designed with cutting-edge technology, this microcontroller offers a wide range of applications in the automotive industry. With its advanced features such as DMA channels, PWM capabilities, and temperature sensors, this product provides unmatched value and efficiency to customers. Trust in NXP Semiconductors' reputation for excellence and elevate your projects to new heights with the SPC5777CLK3MMO3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various applications.

Bit Size: 32

The 32-bit architecture allows for faster processing and handling of complex algorithms, making it a high-performance microcontroller.

ADC Channels: YES

The presence of ADC channels allows for analog-to-digital conversion, enabling the microcontroller to interface with analog sensors or signals.

DMA Channels: YES

DMA channels improve data transfer efficiency by allowing data to be transferred between peripherals and memory without CPU intervention, enhancing overall system performance.

ROM Words: 8388608

With a large ROM size, this microcontroller can store a significant amount of program code and data, making it suitable for applications requiring extensive memory.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers improved performance and efficiency compared to CISC architectures, making it a suitable choice for embedded systems.

Connectivity: CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

The multiple connectivity options enable seamless integration with various communication interfaces, expanding the microcontroller's versatility in networking applications.

RAM Bytes: 524288

The large RAM size allows for efficient data storage and manipulation, enhancing the microcontroller's ability to handle complex computations and multitasking.

Technical Specifications

Microcontrollers SPC5777CLK3MMO3 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e2

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

516

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

RAM Bytes:

524288

ROM Words:

8388608

ROM Programmability:

FLASH

Maximum Seated Height:

2.02 mm

Speed:

264 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

Peripherals:

DMA(128), PWM, TEMPERATURE SENSOR

Trade Compliance

SPC5777CLK3MMO3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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