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LPC18S57JET256E

NXP Semiconductors

LPC18S57JET256E by NXP Semiconductors

LPC18S57JET256E by NXP Semiconductors is a 32-bit microcontroller with a max clock frequency of 25 MHz. It has 164 I/O lines and supports ADC and DMA channels, making it suitable for applications requiring precise analog-to-digital conversion and efficient data transfer.

Median Price

$33.130

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Element14

Singapore . 84 parts In-Stock

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$33.130

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$21.910

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Digiode

USA . 354 parts In-Stock

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$31.474

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Maritex

Poland . 169 parts In-Stock

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$35.100

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$21.414

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Vyrian

USA . 11,604 parts In-Stock

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NAC Semi

USA . 3,960 parts In-Stock

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$15.780

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Anansix

USA . 2,585 parts In-Stock

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Chip Stock

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Nova Conductors

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Distributors (Availability)

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Continental Prestige Electronics

USA . 340 parts In-Stock

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$11.490

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$8.420

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$8.420

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AZTECH Wire

Italy . 596 parts In-Stock

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$12.267

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Corohmni

South Africa . 10 parts In-Stock

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$18.270

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Vigor

Singapore . 1,448 parts In-Stock

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Ampacity Inc.

Singapore . 87 parts In-Stock

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$28.160

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Semicontronic

India . 84 parts In-Stock

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$27.456

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$27.315

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Corphita

USA . 1,744 parts In-Stock

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$29.817

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Microchip USA

USA . 1,651 parts In-Stock

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Aztec Data Supply Inc.

USA . 329 parts In-Stock

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Lixinc

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Argo Parts USA

USA . 4,066 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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UNI Independent Distributors

Spain . 1,064 parts In-Stock

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Perfect Parts

USA . 202 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Experience the next level of performance and versatility with the LPC18S57JET256E microcontroller by NXP Semiconductors. As a leader in semiconductor manufacturing, NXP guarantees superior quality and reliability. Designed for a wide range of applications, this microcontroller offers endless possibilities. With its advanced features and innovative design, it delivers unrivaled value, bringing efficiency and precision to your projects. Discover the advantages of the LPC18S57JET256E and unlock a world of endless opportunities.

Feature Benefit Bullets

Surface Mount: YES

This product is surface mountable, allowing for easy integration onto circuit boards and making it a convenient choice for compact designs.

Maximum Supply Voltage: 3.6 V

The product o/ates within a safe maximum supply voltage of 3.6V, providing a reliable and versatile option for various power supply configurations.

Package Shape: SQUARE

With a square package shape, this microcontroller offers a compact size that can easily fit in tight spaces, maximizing the available board real estate.

Bit Size: 32

The 32-bit architecture of this microcontroller enables enhanced processing capabilities, resulting in faster execution of complex instructions and improved system /formance.

No. of Terminals: 256

With 256 terminals, this microcontroller offers a wide range of connectivity options, allowing for extensive interfacing with other components and /ipherals.

Package Style (Meter): GRID ARRAY

The grid array package style simplifies the placement and soldering process, ensuring reliable connections and facilitating efficient manufacturing.

Minimum Supply Voltage: 2.4 V

The microcontroller can o/ate with a minimum supply voltage of 2.4V, offering the flexibility to function using lower power sources and enabling energy-efficient applications.

ADC Channels: YES

Equipped with ADC channels, this microcontroller can accurately measure analog signals, making it suitable for various applications that require analog-to-digital conversion.

DMA Channels: YES

The presence of DMA channels allows for efficient data transfer between /ipherals and memory, improving system /formance and reducing the workload on the microcontroller's core.

Terminal Position: BOTTOM

With terminals located at the bottom, this microcontroller offers a practical design for easy integration and soldering onto circuit boards, simplifying the assembly process.

Width: 17 mm

The compact width of 17mm enables this microcontroller to fit seamlessly into space-constrained designs, ensuring optimal use of available board area.

Maximum Clock Frequency: 25 MHz

O/ating at a maximum clock frequency of 25MHz, this microcontroller delivers swift execution of instructions, ensuring rapid responsiveness in demanding applications.

Peak Reflow Tem/ature °C: 260

The microcontroller's peak reflow tem/ature of 260°C ensures effective soldering during the manufacturing process, guaranteeing reliable connections and robust product quality.

Length: 17 mm

With a length of 17mm, this microcontroller maintains a compact form factor, making it an ideal choice for applications with limited board space.

/ipheral IC Type: MICROCONTROLLER, RISC

Designed as a microcontroller with a RISC (Reduced Instruction Set Computing) architecture, this product offers efficient and streamlined execution of instructions, enhancing overall system /formance.

Terminal Form: BALL

The ball terminal form provides a reliable and secure connection, making it easier to solder the microcontroller and ensuring stable electrical connections in demanding conditions.

Nominal Supply Voltage: 3.3 V

O/ating at a nominal supply voltage of 3.3V, this microcontroller is compatible with common power sources and widely used voltage levels, simplifying integration and power management.

PWM Channels: YES

Equipped with PWM channels, this microcontroller allows for precise control of pulse-width modulation, enabling applications that require accurate control of motor speed, LED brightness, and other parameters.

Terminal Pitch: 1 mm

With a terminal pitch of 1mm, this microcontroller provides a fine spacing between terminals, facilitating easy layout designs and enabling connections in compact, high-density configurations.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this microcontroller can withstand exposure to moderate moisture levels during storage and handling, ensuring product reliability.

Speed: 180 rpm

With a speed of 180 revolutions / minute, this microcontroller is suitable for applications that require precise rotational control, such as motor control systems or driving mechanical components.

No. of I/O Lines: 164

Featuring 164 input/output lines, this microcontroller provides an extensive range of interface options, allowing for versatile connectivity to external devices and /ipherals.

Technical Specifications

Microcontrollers LPC18S57JET256E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

164

No. of Terminals:

256

PWM Channels:

YES

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Speed:

180 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

LPC18S57JET256E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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