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SPC5777CLK3MMO3R

NXP Semiconductors

SPC5777CLK3MMO3R by NXP Semiconductors

NXP SPC5777CLK3MMO3R is a 32-bit microcontroller with 516 terminals, operating at up to 40 MHz. It features ADC and DMA channels, along with peripherals like PWM and temperature sensor. Ideal for automotive applications due to its flash ROM programmability, CAN, DSPI, Ethernet connectivity, and wide temperature range from -40°C to 125°C.

Median Price

$46.659

Lifecycle Status

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4

In-Stock Inventory

1k+

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Nova Conductors

Japan . 81 parts In-Stock

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Vyrian

USA . 3,793 parts In-Stock

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Anansix

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Digiode

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One Stop Electronics

USA . 1,100 parts In-Stock

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Ampacity Inc.

Singapore . 728 parts In-Stock

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Modulus Dynamics

Lithuania . 3,347 parts In-Stock

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AZTECH Wire

Italy . 895 parts In-Stock

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Advanced Electronics

New Zealand . 78 parts In-Stock

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Corohmni

South Africa . 192 parts In-Stock

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Vigor

Singapore . 1,577 parts In-Stock

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Microchip USA

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Lixinc

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Argo Parts USA

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Continental Prestige Electronics

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Futuretech Components

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Overview

Unlock unprecedented performance and efficiency with the SPC5777CLK3MMO3R microcontroller by NXP Semiconductors. Boasting cutting-edge technology and a wide array of peripherals, this automotive-grade device is ideal for applications requiring high-speed connectivity, advanced sensor integration, and real-time data processing. With its compact design and reliable performance, this microcontroller offers unmatched value and benefits to customers looking to revolutionize their projects. Elevate your designs with NXP Semiconductors and experience superior quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving time and effort during production.

Maximum Supply Voltage: 1.32 V

With a high maximum supply voltage, this microcontroller can handle power fluctuations without risk of damage, ensuring stability in operation.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a PCB, making it suitable for compact designs and applications with limited space.

Bit Size: 32

The 32-bit architecture provides fast processing capabilities and precision, making this microcontroller ideal for tasks that require complex calculations.

No. of Terminals: 516

The large number of terminals offers versatility in connectivity options, allowing for a wide range of external interfaces and peripherals to be integrated.

Package Style (Meter): GRID ARRAY

The grid array package style provides secure connections and reliable performance, making it a preferred choice for applications that require stability and resilience.

Minimum Supply Voltage: 1.2 V

The low minimum supply voltage ensures efficient power consumption, making this microcontroller suitable for battery-powered devices and energy-efficient applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, making it a suitable choice for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the microcontroller to function reliably in extreme cold temperatures, making it a versatile choice for various environments.

Terminal Finish: TIN SILVER

The tin silver terminal finish provides excellent conductivity and resistance to corrosion, ensuring stable connections and long-term performance of the microcontroller.

Technical Specifications

Microcontrollers SPC5777CLK3MMO3R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e2

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

516

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

RAM Bytes:

524288

ROM Words:

8388608

ROM Programmability:

FLASH

Maximum Seated Height:

2.02 mm

Speed:

264 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

Peripherals:

DMA(128), PWM, TEMPERATURE SENSOR

Trade Compliance

SPC5777CLK3MMO3R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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