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SPC5777CAK3MME3

NXP Semiconductors

SPC5777CAK3MME3 by NXP Semiconductors

The NXP Semiconductors SPC5777CAK3MME3 microcontroller features a 32-bit architecture, 416 terminals, and 8388608 ROM words. Ideal for automotive applications, it offers peripherals like DMA(128), PWM, and temperature sensor support. With a max clock frequency of 40 MHz and connectivity options including CAN(4) and ETHERNET, this CMOS technology-based microcontroller is designed for high-performance automotive systems.

Median Price

$39.929

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

USA . 4,411 parts In-Stock

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Digiode

USA . 1,950 parts In-Stock

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Anansix

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Ampacity Inc.

Singapore . 639 parts In-Stock

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$3.000

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One Stop Electronics

USA . 986 parts In-Stock

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AZTECH Wire

Italy . 735 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Vigor

Singapore . 2,958 parts In-Stock

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Microchip USA

USA . 2,791 parts In-Stock

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Corphita

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UNI Independent Distributors

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Overview

Unleash the power of cutting-edge technology with the SPC5777CAK3MME3 by NXP Semiconductors. Designed to excel in automotive applications, this microcontroller offers unparalleled performance and reliability. With a wide range of peripherals including DMA, PWM, and temperature sensors, it provides endless possibilities for innovation. Trust in NXP Semiconductors' reputation for quality and experience in the industry to deliver a product that exceeds expectations. Elevate your projects with the SPC5777CAK3MME3 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

With surface mount capability, this microcontroller can be easily integrated onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for efficient power management and reliable operation in various voltage environments.

Package Shape: SQUARE

The square package shape enables easy alignment and placement on the circuit board, ensuring proper connection and function.

Bit Size: 32

The 32-bit architecture provides enhanced computational power and performance for complex applications and calculations.

No. of Terminals: 416

The large number of terminals offer ample connection options for peripherals and external devices, increasing the versatility of the microcontroller.

Package Style (Meter): GRID ARRAY

The grid array package style provides secure and stable connections, reducing the risk of disconnection or signal loss.

Minimum Supply Voltage: 1.2 V

The low minimum supply voltage ensures efficient power consumption and compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable performance in harsh environments and under extreme conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality even in cold climates or refrigerated environments.

Terminal Finish: TIN SILVER

The tin silver terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.

ADC Channels: YES

The included ADC channels enable analog signal processing and conversion, expanding the range of input sources for the microcontroller.

DMA Channels: YES

The presence of DMA channels allows for efficient data transfer and processing, enhancing the overall performance and speed of the microcontroller.

Terminal Position: BOTTOM

The bottom terminal position simplifies the connection and integration of the microcontroller onto the circuit board, improving accessibility and ease of use.

Technical Specifications

Microcontrollers SPC5777CAK3MME3 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B416

JESD-609 Code:

e2

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

416

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

RAM Bytes:

524288

ROM Words:

8388608

ROM Programmability:

FLASH

Maximum Seated Height:

2.02 mm

Speed:

264 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(4), DSPI(5), EBI, ETHERNET, SCI(5)

Peripherals:

DMA(128), PWM, TEMPERATURE SENSOR

Trade Compliance

SPC5777CAK3MME3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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