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SPC5777CDK3MME3

NXP Semiconductors

SPC5777CDK3MME3 by NXP Semiconductors

The NXP Semiconductors SPC5777CDK3MME3 microcontroller features a 32-bit architecture with 8388608 ROM words and 524288 RAM bytes. It offers peripherals like DMA(128), PWM, and temperature sensor, suitable for automotive applications. With CAN(6), DSPI(5), EBI, Ethernet, and SCI(5) connectivity options, it operates at a max clock frequency of 40 MHz in an automotive-grade package.

Median Price

$58.280

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 399 parts In-Stock

1+ parts

$60.770

100+ parts

$47.444

1k+ parts

$43.429

10k+ parts

-

399

$60.770

$47.444

$43.429

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Mouser Electronics

USA . 184 parts In-Stock

1+ parts

$78.670

100+ parts

$57.630

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184

$78.670

$57.630

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Flip Electronics (Authorized)

USA . 583 parts In-Stock

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583

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Verical

USA . 504 parts In-Stock

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$55.790

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504

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$55.790

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Rochester

USA . 323 parts In-Stock

1+ parts

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100+ parts

$46.290

1k+ parts

$41.420

10k+ parts

$38.980

323

-

$46.290

$41.420

$38.980

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,013 parts In-Stock

1+ parts

$40.717

100+ parts

-

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2,013

$40.717

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Nova Conductors

Japan . 500 parts In-Stock

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$49.940

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500

$49.940

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Vyrian

USA . 7,233 parts In-Stock

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7,233

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Anansix

USA . 1,088 parts In-Stock

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1,088

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Flip Electronics

USA . 583 parts In-Stock

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583

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 392 parts In-Stock

1+ parts

$36.430

100+ parts

-

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392

$36.430

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Corphita

USA . 4,029 parts In-Stock

1+ parts

$38.574

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4,029

$38.574

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Modulus Dynamics

Lithuania . 621 parts In-Stock

1+ parts

$48.390

100+ parts

$48.390

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$48.390

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621

$48.390

$48.390

$48.390

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$48.941

100+ parts

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1k+ parts

$46.984

10k+ parts

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1,000

$48.941

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$46.984

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Continental Prestige Electronics

USA . 6,645 parts In-Stock

1+ parts

$49.940

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$48.941

6,645

$49.940

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$48.941

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$50.939

100+ parts

$50.939

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$50.939

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2,000

$50.939

$50.939

$50.939

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Aztec Data Supply Inc.

USA . 195 parts In-Stock

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$52.060

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195

$52.060

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Corohmni

South Africa . 347 parts In-Stock

1+ parts

$60.137

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347

$60.137

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Microchip USA

USA . 1,046 parts In-Stock

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$148.925

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1,046

$148.925

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Lixinc

USA . 4,203 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 1,526 parts In-Stock

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1,526

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UNI Independent Distributors

Spain . 1,393 parts In-Stock

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1,393

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Robosynatics

Brazil . 848 parts In-Stock

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848

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Lucentia Tech

USA . 848 parts In-Stock

1+ parts

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$64.963

1k+ parts

$63.637

10k+ parts

$63.637

848

-

$64.963

$63.637

$63.637

Overview

Unleash the power of cutting-edge technology with the SPC5777CDK3MME3 from NXP Semiconductors. As a leader in the industry, NXP ensures top-notch quality and reliability in their microcontrollers. Ideal for automotive applications, this microcontroller offers unparalleled performance and versatility with features like DMA, PWM, and a temperature sensor. Experience seamless connectivity with CAN, DSPI, Ethernet, and more. Elevate your projects with the SPC5777CDK3MME3 and unlock endless possibilities. Choose NXP Semiconductors for innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes this microcontroller lightweight and durable.

Surface Mount: YES

The surface mount feature makes it easy to integrate this microcontroller onto a PCB.

Maximum Supply Voltage: 1.32 V

The low maximum supply voltage makes this microcontroller energy efficient.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the PCB.

Bit Size: 32

With a bit size of 32, this microcontroller can handle complex processing tasks efficiently.

No. of Terminals: 416

The high number of terminals enables this microcontroller to connect to various external devices.

Package Style: GRID ARRAY

The grid array package style ensures secure mounting and easy soldering onto the PCB.

Minimum Supply Voltage: 1.2 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this microcontroller suitable for demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this microcontroller to be used in extreme cold conditions.

Terminal Finish: TIN SILVER

The Tin Silver terminal finish provides excellent conductivity and corrosion resistance.

ADC Channels: YES

The inclusion of ADC channels allows this microcontroller to interface with analog sensors.

DMA Channels: YES

The presence of DMA channels enhances data transfer speed and efficiency.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and design.

ROM Words: 8388608

With 8388608 ROM words, this microcontroller has ample memory for storing program data.

Maximum Seated Height: 2.02 mm

The low maximum seated height minimizes the space required for mounting this microcontroller.

Width: 27 mm

The compact width of 27 mm allows for space-efficient PCB design.

Peripherals: DMA(128), PWM, TEMPERATURE SENSOR

The inclusion of multiple peripherals enhances the functionality and versatility of this microcontroller.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency enables fast processing speeds.

Maximum Time At Peak Reflow Temperature: 40s

The short reflow time allows for quick and efficient soldering during manufacturing.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature ensures reliable solder joints.

Length: 27 mm

The compact length of 27 mm facilitates space-saving PCB layout.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliable performance in automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of this microcontroller enhances processing speed and efficiency.

RAM Bytes: 524288

With 524288 RAM bytes, this microcontroller has sufficient memory for data storage and manipulation.

Technology: CMOS

The CMOS technology used in this microcontroller provides low power consumption and high noise immunity.

Terminal Form: BALL

The ball terminal form facilitates easy soldering and reliable electrical connections.

PWM Channels: YES

The availability of PWM channels enables precise control of output signals.

Connectivity: CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

The multiple connectivity options make this microcontroller versatile for various communication protocols.

ROM Programmability: FLASH

The flash programmability of ROM allows for easy and quick updates of firmware.

Terminal Pitch: 1 mm

The 1 mm terminal pitch simplifies the PCB design and assembly process.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that this microcontroller is suitable for reflow soldering.

Speed: 264 rpm

The high speed of 264 rpm ensures efficient data processing and operation.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM allows for efficient data storage and retrieval.

Technical Specifications

Microcontrollers SPC5777CDK3MME3 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B416

JESD-609 Code:

e2

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

416

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

RAM Bytes:

524288

ROM Words:

8388608

ROM Programmability:

FLASH

Maximum Seated Height:

2.02 mm

Speed:

264 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

Peripherals:

DMA(128), PWM, TEMPERATURE SENSOR

Trade Compliance

SPC5777CDK3MME3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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