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LPC54607J256BD208E

NXP Semiconductors

LPC54607J256BD208E by NXP Semiconductors

NXP Semiconductors' LPC54607J256BD208E microcontroller features a 32-bit CORTEX-M4 CPU, 12-Ch 12-Bit ADC, and 171 I/O lines. With a max clock frequency of 25 MHz, it is ideal for applications requiring high-speed data processing. This microcontroller supports various connectivity options such as I2C, SPI, USART, and USB for versatile integration in electronic systems.

Median Price

$11.272

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 684 parts In-Stock

1+ parts

$14.970

100+ parts

$8.240

1k+ parts

$8.160

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684

$14.970

$8.240

$8.160

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Verical

USA . 9,972 parts In-Stock

1+ parts

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$7.574

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9,972

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$7.574

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Distributors (In-Stock)

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Nova Conductors

Japan . 49 parts In-Stock

1+ parts

$9.280

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49

$9.280

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Digiode

USA . 984 parts In-Stock

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$12.274

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984

$12.274

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Vyrian

USA . 7,450 parts In-Stock

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7,450

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Anansix

USA . 929 parts In-Stock

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929

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Chip Stock

USA . 157 parts In-Stock

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157

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Distributors (Availability)

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Continental Prestige Electronics

USA . 3,981 parts In-Stock

1+ parts

$9.280

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$9.094

3,981

$9.280

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$9.094

AZTECH Wire

Italy . 694 parts In-Stock

1+ parts

$9.920

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$9.920

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Vigor

Singapore . 5,627 parts In-Stock

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$10.477

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Corohmni

South Africa . 318 parts In-Stock

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$10.600

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318

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Semicontronic

India . 643 parts In-Stock

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$10.980

100+ parts

$10.706

1k+ parts

$10.651

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643

$10.980

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$10.651

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Ampacity Inc.

Singapore . 606 parts In-Stock

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$10.980

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Corphita

USA . 2,733 parts In-Stock

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$11.628

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Microchip USA

USA . 2,341 parts In-Stock

1+ parts

$30.080

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$29.650

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$29.440

10k+ parts

$29.220

2,341

$30.080

$29.650

$29.440

$29.220

Aztec Data Supply Inc.

USA . 4,872 parts In-Stock

1+ parts

$58.528

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Argo Parts USA

USA . 4,523 parts In-Stock

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4,523

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UNI Independent Distributors

Spain . 3,176 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$9.094

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$8.816

10k+ parts

$8.630

1,000

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$9.094

$8.816

$8.630

Overview

Unleash the power of innovation with the LPC54607J256BD208E by NXP Semiconductors, a cutting-edge microcontroller that sets new standards in performance and reliability. This versatile device is perfect for a wide range of applications, from IoT devices to industrial automation. With its superior quality and advanced features, this product offers unmatched value and benefits to customers looking to stay ahead in today's fast-paced tech world. Experience the difference with NXP Semiconductors and revolutionize your projects with the LPC54607J256BD208E.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort.

Maximum Supply Voltage: 3.6 V

Provides flexibility in powering the microcontroller within a safe voltage range.

Address Bus Width: 14

Allows for a larger memory address space, enabling more complex applications.

Package Shape: SQUARE

Saves space on the circuit board and ensures efficient use of available area.

Bit Size: 32

Offers higher processing capabilities and precision in handling data.

No. of Terminals: 208

Provides ample connectivity options for various peripherals and external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables a compact and lightweight design for applications with space constraints.

Minimum Supply Voltage: 1.71 V

Allows for operation in low power scenarios, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

CPU Family: CORTEX-M4

A powerful and efficient processor architecture suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

Works reliably in extreme cold conditions without any issues.

ADC Channels: YES

Enables analog to digital conversion for interfacing with sensors and other analog devices.

DMA Channels: YES

Facilitates direct memory access for efficient data transfer and processing.

Terminal Position: QUAD

Streamlines the layout of terminals for easier PCB routing and connectivity.

ROM Words: 262144

Provides ample storage space for program instructions and data storage.

Width: 28 mm

Compact size allows for integration into small form factor devices.

External Data Bus Width: 16

Efficient data transfer between external devices for improved performance.

Peripherals: BOD, DMA(30), RTC, TIMER(8), WDT

A wide range of built-in peripherals for enhanced functionality and versatility.

Maximum Clock Frequency: 25 MHz

Provides fast processing speed for quick execution of tasks.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow soldering processes during assembly.

Length: 28 mm

Compact dimensions make this microcontroller suitable for space-constrained applications.

Peripheral IC Type: MICROCONTROLLER, RISC

A modern RISC-based microcontroller architecture for efficient performance.

RAM Bytes: 139264

Provides ample volatile memory for temporary data storage and processing requirements.

Terminal Form: GULL WING

Ensures secure and reliable solder connections for improved durability.

Analog To Digital Convertors: 12-Ch 12-Bit

Allows for precise and accurate conversion of analog signals into digital data.

Nominal Supply Voltage: 1.8 V

Optimal voltage for stable and efficient operation of the microcontroller.

PWM Channels: YES

Enables pulse width modulation for controlling various devices and components.

Connectivity: I2C(10), I2S(10), SPI(10), USART(10), USB(2)

A wide range of communication interfaces for seamless connectivity with external devices.

ROM Programmability: FLASH

Allows for reprogramming of the ROM memory for flexible application development.

Terminal Pitch: 0.5 mm

Fine pitch terminals enable high-density packaging for smaller footprint designs.

Moisture Sensitivity Level (MSL): 3

Suitable for assembly processes with medium to high sensitivity to moisture.

Speed: 180 rpm

Capable of handling high-speed data processing and control tasks.

On Chip Program ROM Width: 8

Efficient use of on-chip ROM for storing program instructions and data.

No. of I/O Lines: 171

Ample input-output lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LPC54607J256BD208E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

14

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Length:

28 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

171

No. of Terminals:

208

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

139264

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

180 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(10), I2S(10), SPI(10), USART(10), USB(2)

Peripherals:

BOD, DMA(30), RTC, TIMER(8), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

LPC54607J256BD208E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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