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MC9S08PB16MTJ

NXP Semiconductors

MC9S08PB16MTJ by NXP Semiconductors

MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Pitch: .65 mm;

Median Price

$1.400

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 149 parts In-Stock

1+ parts

$1.230

100+ parts

$1.150

1k+ parts

$1.040

10k+ parts

-

149

$1.230

$1.150

$1.040

-

Farnell

UK . 5 parts In-Stock

1+ parts

$1.400

100+ parts

-

1k+ parts

-

10k+ parts

-

5

$1.400

-

-

-

DigiKey

USA . 135 parts In-Stock

1+ parts

$2.160

100+ parts

$1.324

1k+ parts

$1.175

10k+ parts

$1.079

135

$2.160

$1.324

$1.175

$1.079

Mouser Electronics

USA . 85 parts In-Stock

1+ parts

$2.160

100+ parts

$1.260

1k+ parts

$1.170

10k+ parts

$1.070

85

$2.160

$1.260

$1.170

$1.070

Verical

USA . 9,975 parts In-Stock

1+ parts

-

100+ parts

$1.082

1k+ parts

-

10k+ parts

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9,975

-

$1.082

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-

Flip Electronics (Authorized)

USA . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

300

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,418 parts In-Stock

1+ parts

$1.168

100+ parts

-

1k+ parts

-

10k+ parts

-

3,418

$1.168

-

-

-

IBS Electronics

USA . 65,992 parts In-Stock

1+ parts

-

100+ parts

$1.320

1k+ parts

$1.229

10k+ parts

-

65,992

-

$1.320

$1.229

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Vyrian

USA . 4,245 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,245

-

-

-

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Anansix

USA . 933 parts In-Stock

1+ parts

-

100+ parts

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933

-

-

-

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Flip Electronics

USA . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

300

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 111 parts In-Stock

1+ parts

$1.050

100+ parts

-

1k+ parts

-

10k+ parts

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111

$1.050

-

-

-

Corphita

USA . 4,320 parts In-Stock

1+ parts

$1.107

100+ parts

-

1k+ parts

-

10k+ parts

-

4,320

$1.107

-

-

-

Continental Prestige Electronics

USA . 5 parts In-Stock

1+ parts

$2.710

100+ parts

$1.450

1k+ parts

$1.370

10k+ parts

-

5

$2.710

$1.450

$1.370

-

Microchip USA

USA . 2,558 parts In-Stock

1+ parts

$17.550

100+ parts

-

1k+ parts

-

10k+ parts

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2,558

$17.550

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,000

-

-

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-

UNI Independent Distributors

Spain . 2,855 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,855

-

-

-

-

iodParts Technologies Inc.

India . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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300

-

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-

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Technical Specifications

Microcontrollers MC9S08PB16MTJ attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

20 MHz

DMA Channels:

NO

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

18

No. of Terminals:

20

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Speed:

20 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

MC9S08PB16MTJ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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