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MC9S08PL16CTJ

NXP Semiconductors

MC9S08PL16CTJ by NXP Semiconductors

MICROCONTROLLER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3;

Median Price

$1.650

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 800 parts In-Stock

1+ parts

$2.600

100+ parts

$1.616

1k+ parts

$1.440

10k+ parts

$1.326

800

$2.600

$1.616

$1.440

$1.326

Verical

USA . 2,075 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.650

10k+ parts

$1.475

2,075

-

-

$1.650

$1.475

Rochester

USA . 2,075 parts In-Stock

1+ parts

-

100+ parts

$1.590

1k+ parts

$1.320

10k+ parts

$1.180

2,075

-

$1.590

$1.320

$1.180

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,799 parts In-Stock

1+ parts

$2.004

100+ parts

-

1k+ parts

-

10k+ parts

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3,799

$2.004

-

-

-

Flip Electronics

USA . 4,500 parts In-Stock

1+ parts

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4,500

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Vyrian

USA . 4,219 parts In-Stock

1+ parts

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4,219

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-

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Anansix

USA . 2,786 parts In-Stock

1+ parts

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2,786

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Nova Conductors

Japan . 93 parts In-Stock

1+ parts

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93

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,140 parts In-Stock

1+ parts

$1.790

100+ parts

-

1k+ parts

-

10k+ parts

-

1,140

$1.790

-

-

-

Corphita

USA . 4,511 parts In-Stock

1+ parts

$1.899

100+ parts

-

1k+ parts

-

10k+ parts

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4,511

$1.899

-

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Microchip USA

USA . 1,935 parts In-Stock

1+ parts

$18.070

100+ parts

$17.960

1k+ parts

$17.900

10k+ parts

$17.850

1,935

$18.070

$17.960

$17.900

$17.850

Corohmni

South Africa . 509 parts In-Stock

1+ parts

$26.012

100+ parts

-

1k+ parts

-

10k+ parts

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509

$26.012

-

-

-

Aztec Data Supply Inc.

USA . 3,979 parts In-Stock

1+ parts

$56.644

100+ parts

-

1k+ parts

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10k+ parts

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3,979

$56.644

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Continental Prestige Electronics

USA . 5,982 parts In-Stock

1+ parts

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5,982

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Lixinc

USA . 5,173 parts In-Stock

1+ parts

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5,173

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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5,000

-

-

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Argo Parts USA

USA . 3,090 parts In-Stock

1+ parts

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3,090

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UNI Independent Distributors

Spain . 2,403 parts In-Stock

1+ parts

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2,403

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Aranea Global

USA . 500 parts In-Stock

1+ parts

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500

-

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-

Technical Specifications

Microcontrollers MC9S08PL16CTJ attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

MC9S08PL16CTJ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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