Loading...

SPC5777MK0MVA8R

NXP Semiconductors

SPC5777MK0MVA8R by NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 512; Package Code: FBGA; Package Shape: SQUARE;

Median Price

$53.929

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$53.929

10k+ parts

-

9,900

-

-

$53.929

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 180 parts In-Stock

1+ parts

$47.482

100+ parts

$38.935

1k+ parts

-

10k+ parts

-

180

$47.482

$38.935

-

-

Vyrian

USA . 5,998 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,998

-

-

-

-

Anansix

USA . 2,681 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,681

-

-

-

-

Digiode

USA . 1,524 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,524

-

-

-

-

Dan-Mar Components

USA . 180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

180

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 644 parts In-Stock

1+ parts

$20.770

100+ parts

-

1k+ parts

-

10k+ parts

-

644

$20.770

-

-

-

One Stop Electronics

USA . 247 parts In-Stock

1+ parts

$32.000

100+ parts

-

1k+ parts

-

10k+ parts

-

247

$32.000

-

-

-

Microchip USA

USA . 2,980 parts In-Stock

1+ parts

$123.915

100+ parts

-

1k+ parts

-

10k+ parts

-

2,980

$123.915

-

-

-

Corphita

USA . 3,802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,802

-

-

-

-

Vigor

Singapore . 3,213 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,213

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

UNI Independent Distributors

Spain . 709 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

709

-

-

-

-

Technical Specifications

Microcontrollers SPC5777MK0MVA8R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

INCLUDES GTM104, ETHERNET SUPPORT, 74KB(ADDITIONAL RAM)

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B512

JESD-609 Code:

e2

Length:

25 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

0

No. of Terminals:

512

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

413696

ROM Words:

8388608

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

2.36 mm

Speed:

300 rpm

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.19 V

Nominal Supply Voltage:

1.325 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

25 mm

Peripheral IC Type:

Data EEPROM Size:

544K

Connectivity:

CAN(5), DSPI(8), I2C(2), PSI5(5), SENT(15), UART(3)

Peripherals:

DMA(128), TIMER(8), WDT(4)

Analog To Digital Convertors:

12-Ch 12-Bit, 10-Ch 16-Bit

Trade Compliance

SPC5777MK0MVA8R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20