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SPC5777CCK3MME3R

NXP Semiconductors

SPC5777CCK3MME3R by NXP Semiconductors

NXP Semiconductors' SPC5777CCK3MME3R microcontroller features 32-bit architecture, 8388608 ROM words, and 524288 RAM bytes. Ideal for automotive applications with CAN(6), DSPI(5), EBI, ETHERNET connectivity, and peripherals like DMA(128) and PWM channels. Operating temperature ranges from -40 to 125 °C with a max clock frequency of 40 MHz.

Median Price

$44.571

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Verical

USA . 10,000 parts In-Stock

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Vyrian

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Digiode

USA . 1,374 parts In-Stock

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Anansix

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Nova Conductors

Japan . 150 parts In-Stock

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Semicontronic

India . 227 parts In-Stock

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$5.850

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$5.820

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Ampacity Inc.

Singapore . 345 parts In-Stock

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AZTECH Wire

Italy . 566 parts In-Stock

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One Stop Electronics

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Corohmni

South Africa . 15 parts In-Stock

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Vigor

Singapore . 1,937 parts In-Stock

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Microchip USA

USA . 2,758 parts In-Stock

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$100.630

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$99.740

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Lixinc

USA . 19,354 parts In-Stock

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Corphita

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Overview

Enhance your automotive applications with the NXP Semiconductors SPC5777CCK3MME3R microcontroller, a high-quality solution designed to meet your performance needs. As a leader in the industry, NXP Semiconductors delivers reliable products that offer advanced features and capabilities, including ADC channels, DMA channels, and PWM peripherals. With a maximum clock frequency of 40 MHz and a wide range of connectivity options, this microcontroller provides exceptional value and versatility for your projects. Trust NXP Semiconductors to power your innovations with cutting-edge technology and superior performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the microcontroller suitable for various applications while keeping the overall weight low.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage allows for better performance and flexibility in power supply design.

Bit Size: 32

32-bit microcontrollers offer higher computational power and can handle more complex tasks compared to lower bit sizes.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC (Reduced Instruction Set Computing) architecture provides efficient and fast processing of instructions, enhancing the overall performance of the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy efficient and reliable in noisy environments.

Technical Specifications

Microcontrollers SPC5777CCK3MME3R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B416

JESD-609 Code:

e2

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

416

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

RAM Bytes:

524288

ROM Words:

8388608

ROM Programmability:

FLASH

Maximum Seated Height:

2.02 mm

Speed:

264 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

Peripherals:

DMA(128), PWM, TEMPERATURE SENSOR

Trade Compliance

SPC5777CCK3MME3R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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