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SPC5777CK3MME3

NXP Semiconductors

SPC5777CK3MME3 by NXP Semiconductors

NXP Semiconductors' SPC5777CK3MME3 microcontroller features a 32-bit CPU with E200Z7 family, 524288 RAM bytes, and 8388608 ROM words. It is designed for automotive applications with CAN(4), SCI(5), SPI(5) connectivity, PWM channels, and low power mode support. The microcontroller operates at a max clock frequency of 40 MHz and has a temperature grade suitable for automotive environments.

Median Price

$77.100

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 92 parts In-Stock

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$77.100

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$55.220

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EBV Elektronik

Germany . 40 parts In-Stock

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40

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Digiode

USA . 1,460 parts In-Stock

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$43.254

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$43.254

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Nova Conductors

Japan . 50 parts In-Stock

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$44.700

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$44.700

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Vyrian

USA . 4,496 parts In-Stock

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Anansix

USA . 836 parts In-Stock

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836

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AZTECH Wire

Italy . 346 parts In-Stock

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$17.705

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Ampacity Inc.

Singapore . 69 parts In-Stock

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$38.700

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69

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Corphita

USA . 4,051 parts In-Stock

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$40.977

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4,051

$40.977

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Netroflash

USA . 1,000 parts In-Stock

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$44.700

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$42.465

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$41.571

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Vigor

Singapore . 153 parts In-Stock

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$70.210

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Microchip USA

USA . 2,171 parts In-Stock

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$145.958

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Lixinc

USA . 7,553 parts In-Stock

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iodParts Technologies Inc.

India . 5,000 parts In-Stock

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UNI Independent Distributors

Spain . 3,875 parts In-Stock

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Perfect Parts

USA . 90 parts In-Stock

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Overview

Elevate your projects with the SPC5777CK3MME3 by NXP Semiconductors, a top-tier microcontroller designed for optimal performance. With a reputable manufacturer like NXP Semiconductors, you can trust in the quality and reliability of this product. Ideal for a wide range of applications, this microcontroller offers advanced features such as integrated cache and ADC channels, making it a versatile choice for your projects. Experience seamless connectivity and high-speed processing with the SPC5777CK3MME3, providing value, efficiency, and innovation to customers seeking top-notch performance in their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable, ideal for portable and rugged applications.

Integrated Cache: YES

The presence of integrated cache enhances the processing speed and efficiency of the microcontroller, making it suitable for tasks requiring quick data access.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration of the microcontroller onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage capability of this microcontroller ensures reliable operation even in systems with varying voltage levels, increasing its versatility.

On Chip Data RAM Width: 8

The wide on-chip data RAM width of 8 bits enables the microcontroller to handle multiple data types simultaneously, improving overall performance.

Package Shape: SQUARE

The square package shape offers a balanced footprint, making it easier to design compact and efficient PCB layouts while maximizing space utilization.

Bit Size: 32

With a bit size of 32, this microcontroller can process data in larger chunks, facilitating complex computations and enhancing overall processing speed.

No. of Terminals: 416

The large number of terminals provides ample connectivity options, allowing for versatile interfacing with external devices and expansion modules.

Package Style (Meter): GRID ARRAY

The grid array package style enhances thermal performance and reliability, making it suitable for applications requiring high durability and heat dissipation.

Minimum Supply Voltage: 1.2 V

The low minimum supply voltage requirement ensures energy-efficient operation, making this microcontroller an excellent choice for battery-powered devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this microcontroller can withstand harsh environmental conditions, enhancing its durability and reliability.

CPU Family: E200Z7

The E200Z7 CPU family offers a powerful processing architecture, enabling the microcontroller to handle complex algorithms and tasks efficiently.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 125°C makes this microcontroller suitable for use in extreme environments, ensuring reliable performance in various conditions.

Terminal Finish: TIN SILVER

The use of tin silver terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections and long-term performance.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to interface with analog sensors and signals, enabling precise measurements and control in real-time applications.

Technical Specifications

Microcontrollers SPC5777CK3MME3 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE.

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z7

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B416

JESD-609 Code:

e2

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of External Interrupts:

1

No. of Serial I/Os:

5

No. of Terminals:

416

No. of Timers:

0

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA416,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

RAM Bytes:

524288

ROM Words:

8388608

ROM Programmability:

FLASH

Maximum Seated Height:

2.02 mm

Speed:

264 rpm

Maximum Supply Current:

1350 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(4), SCI(5), SPI(5)

Peripherals:

POR

Trade Compliance

SPC5777CK3MME3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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