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SPC5777CK3MMO3R

NXP Semiconductors

SPC5777CK3MMO3R by NXP Semiconductors

The NXP Semiconductors SPC5777CK3MMO3R microcontroller features a 32-bit architecture, with 8388608 ROM words and 524288 RAM bytes. It offers connectivity options like CAN(6), DSPI(5), EBI, ETHERNET, SCI(5) and peripherals including DMA(128), PWM, and a temperature sensor. Ideal for automotive applications due to its temperature grade of AUTOMOTIVE and max operating temperature of 125°C.

Median Price

$43.631

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 95 parts In-Stock

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$43.631

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95

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Vyrian

USA . 8,407 parts In-Stock

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8,407

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Digiode

USA . 1,009 parts In-Stock

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1,009

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Anansix

USA . 675 parts In-Stock

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675

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Distributors (Availability)

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One Stop Electronics

USA . 860 parts In-Stock

1+ parts

$3.000

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860

$3.000

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AZTECH Wire

Italy . 476 parts In-Stock

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$7.201

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476

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Ampacity Inc.

Singapore . 181 parts In-Stock

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$29.000

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$29.555

100+ parts

$26.895

1k+ parts

$24.235

10k+ parts

-

3,000

$29.555

$26.895

$24.235

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Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$43.630

100+ parts

$41.448

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$38.831

300

$43.630

$41.448

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$38.831

Vigor

Singapore . 3,892 parts In-Stock

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$74.530

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Microchip USA

USA . 2,790 parts In-Stock

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$105.369

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2,790

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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UNI Independent Distributors

Spain . 2,574 parts In-Stock

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Corphita

USA . 247 parts In-Stock

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Overview

Unleash the power of innovation with the SPC5777CK3MMO3R by NXP Semiconductors, a cutting-edge microcontroller that embodies excellence in quality and reliability. Designed for automotive applications, this microcontroller boasts advanced features such as DMA channels, PWM, and a built-in temperature sensor, providing unparalleled performance and efficiency. With its flash ROM programmability and extensive connectivity options including CAN, DSPI, and Ethernet, the SPC5777CK3MMO3R offers endless possibilities for customization and integration. Elevate your projects to new heights with this top-of-the-line microcontroller, delivering value and precision like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and quick assembly of the product onto PCBs, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage of 1.32 V allows for flexibility in power supply options, ensuring stability and reliability in operation.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, optimizing board layout and design.

Bit Size: 32

The 32-bit architecture provides enhanced processing power and performance, making the product suitable for complex applications that require high-speed processing.

No. of Terminals: 516

With a high number of terminals, the product offers extensive connectivity options and interfaces for versatile integration with other components and devices.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and organized layout of terminals, facilitating ease of soldering and ensuring reliable electrical connections.

Minimum Supply Voltage: 1.2 V

The low minimum supply voltage of 1.2 V helps in minimizing power consumption and optimizing energy efficiency in the product.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the product to perform reliably in harsh environmental conditions or high-temperature environments.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature from -40°C ensures the product's functionality in cold temperature settings or freezing conditions.

Terminal Finish: TIN SILVER

The tin silver terminal finish offers excellent conductivity and corrosion resistance, ensuring long-lasting and stable electrical connections.

ADC Channels: YES

The presence of ADC channels allows the product to convert analog signals into digital data, enabling accurate and precise measurements in various applications.

DMA Channels: YES

DMA channels enhance data transfer efficiency by enabling direct memory access, reducing CPU overhead and improving system performance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure mounting of the product onto the PCB, ensuring reliable mechanical support and electrical connections.

ROM Words: 8388608

With a large ROM capacity of 8388608 words, the product can store extensive program codes and data, supporting complex applications and customization options.

Maximum Seated Height: 2.02 mm

The low maximum seated height of 2.02 mm allows the product to fit into compact electronic devices or space-constrained applications.

Width: 27 mm

The moderate width of 27 mm offers a balance between compact size and sufficient spacing for terminal connections, enabling easy integration into various system designs.

Peripherals: DMA(128), PWM, TEMPERATURE SENSOR

The inclusion of multiple peripherals such as DMA, PWM, and a temperature sensor enhances the product's functionality and versatility for diverse application requirements.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency of 40 MHz provides fast and efficient processing capabilities, ideal for applications demanding high-speed data processing.

Maximum Time At Peak Reflow Temperature (s): 40

The specified time at peak reflow temperature of 40 seconds ensures proper soldering and reflow processes during manufacturing, maintaining product reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C offers robust solder joints and ensures product durability under thermal stress or reflow conditions.

Length: 27 mm

The length of 27 mm provides a compact form factor for the product, allowing for versatile placement and integration into various electronic devices or systems.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates the product's ability to withstand harsh automotive environments, making it suitable for automotive applications requiring high reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with a RISC architecture, the product offers efficient data processing capabilities, low power consumption, and enhanced system performance for embedded applications.

RAM Bytes: 524288

The large RAM capacity of 524288 bytes provides ample working memory for data storage and processing, supporting multitasking and complex algorithms in applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption, high noise immunity, and reliable operation, making the product energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

The ball terminal form offers secure solder connections and efficient heat dissipation, enhancing the product's electrical performance and reliability in demanding applications.

PWM Channels: YES

The availability of PWM channels allows for precise control of analog signals, enabling the product to generate variable output voltages for motor control, lighting, and other applications.

Connectivity: CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

The diverse connectivity options such as CAN, DSPI, EBI, Ethernet, and SCI interfaces support a wide range of communication protocols and networking capabilities, making the product suitable for IoT and networking applications.

ROM Programmability: FLASH

The programmability of ROM using flash technology allows for easy firmware updates and customization, enabling the product to adapt to evolving requirements and enhance functionality.

Terminal Pitch: 1 mm

The narrow terminal pitch of 1 mm enables high-density interconnections on the PCB, optimizing space usage and layout design for compact electronic devices.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates the product's resistance to moisture absorption during storage and handling, ensuring reliability and performance in humid environments.

Speed: 264 rpm

The specified speed of 264 rotations per minute denotes the product's capability for processing data and executing instructions at a high speed, suitable for time-sensitive applications.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM offers efficient storage and retrieval of program instructions, supporting seamless execution of code and enhancing overall system performance.

Technical Specifications

Microcontrollers SPC5777CK3MMO3R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e2

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

516

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

RAM Bytes:

524288

ROM Words:

8388608

ROM Programmability:

FLASH

Maximum Seated Height:

2.02 mm

Speed:

264 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

Peripherals:

DMA(128), PWM, TEMPERATURE SENSOR

Trade Compliance

SPC5777CK3MMO3R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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