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MKE14Z128VLL7

NXP Semiconductors

MKE14Z128VLL7 by NXP Semiconductors

NXP Semiconductors MKE14Z128VLL7 is a 32-bit microcontroller with Cortex-M0 CPU, 131072 ROM words, and 16384 RAM bytes. It features 28-Ch 12-Bit ADC channels, 8 DMA channels, and PWM support. Ideal for industrial applications requiring low power consumption and high-speed processing up to 40 MHz.

Median Price

$4.826

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 90 parts In-Stock

1+ parts

$2.360

100+ parts

$2.310

1k+ parts

$2.270

10k+ parts

-

90

$2.360

$2.310

$2.270

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Mouser Electronics

USA . 450 parts In-Stock

1+ parts

$6.160

100+ parts

$3.550

1k+ parts

$3.310

10k+ parts

-

450

$6.160

$3.550

$3.310

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DigiKey

USA . 350 parts In-Stock

1+ parts

$6.160

100+ parts

$3.987

1k+ parts

$3.648

10k+ parts

$3.466

350

$6.160

$3.987

$3.648

$3.466

Verical

USA . 9,900 parts In-Stock

1+ parts

-

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$3.491

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9,900

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$3.491

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Avnet

USA . 1,350 parts In-Stock

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-

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1,350

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Distributors (In-Stock)

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Digiode

USA . 2,676 parts In-Stock

1+ parts

$2.242

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-

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2,676

$2.242

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Vyrian

USA . 4,153 parts In-Stock

1+ parts

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4,153

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TME

Poland . 1,350 parts In-Stock

1+ parts

-

100+ parts

$4.210

1k+ parts

-

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1,350

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$4.210

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Anansix

USA . 797 parts In-Stock

1+ parts

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797

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,109 parts In-Stock

1+ parts

$2.124

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1,109

$2.124

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Microchip USA

USA . 2,234 parts In-Stock

1+ parts

$31.840

100+ parts

$31.650

1k+ parts

$31.550

10k+ parts

$31.450

2,234

$31.840

$31.650

$31.550

$31.450

UNI Independent Distributors

Spain . 7,478 parts In-Stock

1+ parts

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7,478

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Overview

Enhance your electronic designs with the cutting-edge MKE14Z128VLL7 microcontroller from NXP Semiconductors. Crafted with precision and expertise, this device offers unparalleled performance in a wide range of applications. From industrial automation to consumer electronics, the MKE14Z128VLL7 delivers value, efficiency, and reliability. Experience seamless connectivity, low power consumption, and advanced features that will elevate your projects to new heights. Trust NXP Semiconductors for top-quality solutions that meet and exceed your expectations. Elevate your designs with the MKE14Z128VLL7 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to environmental factors, making the microcontroller suitable for a variety of applications.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options without risking damage to the microcontroller.

CPU Family: CORTEX-M0

The CORTEX-M0 architecture provides a balance between performance and power efficiency, making it suitable for a wide range of applications.

Maximum Clock Frequency: 40 MHz

Offers high processing speed for smooth operation and responsiveness in real-time applications.

Analog To Digital Convertors: 28-Ch 12-Bit

Enables accurate and precise conversion of analog signals into digital data for high-quality sensor data acquisition.

Connectivity: I2C(2), SPI(2), UART(3)

Provides multiple communication interfaces for connecting with external devices and peripherals, enhancing the microcontroller's versatility.

Low Power Mode: YES

Allows for power-efficient operation, extending battery life and reducing overall power consumption in portable or energy-sensitive applications.

Technical Specifications

Microcontrollers MKE14Z128VLL7 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

FLEXRAM WITH 2KB FOR EEPROM EMULATION

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

8

No. of External Interrupts:

1

No. of I/O Lines:

89

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

72 rpm

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI(2), UART(3)

Peripherals:

COMPARATOR(2), DMA(8), POR, RTC, TIMER(21), WDT

Analog To Digital Convertors:

28-Ch 12-Bit

Trade Compliance

MKE14Z128VLL7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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