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SPC5777CK3MME3R

NXP Semiconductors

SPC5777CK3MME3R by NXP Semiconductors

The NXP Semiconductors SPC5777CK3MME3R is a 32-bit microcontroller with a max clock frequency of 40 MHz. It features 416 terminals, CAN and DSPI connectivity, and on-chip program ROM width of 8. This automotive-grade microcontroller is suitable for applications requiring high-speed processing and advanced connectivity capabilities.

Median Price

$68.726

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 350 parts In-Stock

1+ parts

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350

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Flip Electronics (Authorized)

USA . 350 parts In-Stock

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350

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Verical

USA . 336 parts In-Stock

1+ parts

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100+ parts

$68.726

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336

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$68.726

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$41.586

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750

$41.586

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Vyrian

USA . 8,214 parts In-Stock

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8,214

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Digiode

USA . 2,761 parts In-Stock

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2,761

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Anansix

USA . 2,682 parts In-Stock

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2,682

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Flip Electronics

USA . 350 parts In-Stock

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350

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 803 parts In-Stock

1+ parts

$8.652

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803

$8.652

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Ampacity Inc.

Singapore . 49 parts In-Stock

1+ parts

$21.000

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49

$21.000

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Netroflash

USA . 100 parts In-Stock

1+ parts

$41.586

100+ parts

$40.755

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100

$41.586

$40.755

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Vigor

Singapore . 2,077 parts In-Stock

1+ parts

$71.030

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2,077

$71.030

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Aztec Data Supply Inc.

USA . 120 parts In-Stock

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$80.958

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120

$80.958

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Microchip USA

USA . 3,130 parts In-Stock

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$103.300

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Corphita

USA . 4,437 parts In-Stock

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4,437

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UNI Independent Distributors

Spain . 1,993 parts In-Stock

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1,993

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Overview

Discover the SPC5777CK3MME3R by NXP Semiconductors, a game-changing microcontroller that delivers unparalleled quality and performance. Designed with expertise by NXP Semiconductors, a renowned manufacturer in the industry, this innovative device is equipped with advanced features and capabilities. Ideal for a wide range of applications, it offers customers exceptional value, benefits, and advantages. With its superior technology and reliability, the SPC5777CK3MME3R empowers you to elevate your projects to new heights. Experience the difference today and unlock endless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This microcontroller's plastic/epoxy package body material offers durability and protection, making it suitable for a wide range of electronic applications.

Surface Mount: YES

With its surface mount capability, this microcontroller offers convenient installation and integration into various circuit boards, enhancing overall versatility and ease of use.

Maximum Supply Voltage: 1.32 V

The microcontroller's maximum supply voltage of 1.32 V ensures reliable and stable power delivery, minimizing the risk of voltage spikes and potential damage to the device.

Package Shape: SQUARE

Featuring a square package shape, this microcontroller offers efficient use of space and easy placement, making it ideal for compact designs or applications with limited board real estate.

Bit Size: 32

With a bit size of 32, this microcontroller provides enhanced processing capabilities, allowing for faster and more efficient execution of complex instructions and algorithms.

No. of Terminals: 416

The 416 terminals on this microcontroller enable seamless connectivity with various external components and peripherals, facilitating a wide range of input and output options.

Package Style (Meter): GRID ARRAY

The grid array package style of this microcontroller ensures reliable electrical connections and robust mechanical stability, offering excellent resistance against vibration and thermal stress.

Minimum Supply Voltage: 1.2 V

With its low minimum supply voltage requirement of 1.2 V, this microcontroller delivers energy-efficient performance, enabling power savings and prolonging battery life in portable devices.

Maximum Operating Temperature: 125 °C

The microcontroller's maximum operating temperature of 125°C ensures durability and reliability even in harsh environmental conditions, making it suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

The microcontroller's minimum operating temperature of -40°C allows it to withstand extreme cold environments, ensuring reliable functionality in a wide range of temperature conditions.

Terminal Finish: TIN SILVER

The terminal finish of this microcontroller, with a combination of tin and silver, offers excellent conductivity, corrosion resistance, and solderability, ensuring high-quality connections and long-term reliability.

ADC Channels: YES

With its built-in ADC channels, this microcontroller enables accurate analog-to-digital conversion, making it suitable for applications that require precise sensing and measurement capabilities.

DMA Channels: YES

The presence of DMA channels in this microcontroller allows for efficient data transfer between different peripherals and memory, reducing the load on the CPU and enhancing overall system performance.

Terminal Position: BOTTOM

With its bottom terminal position, this microcontroller offers convenient soldering and placement options, making it suitable for various PCB layouts and assembly processes.

ROM Words: 8388608

The impressive capacity of 8388608 ROM words in this microcontroller provides ample space for storing program instructions, enabling the implementation of complex algorithms and extensive software applications.

Maximum Seated Height: 2.02 mm

With its compact maximum seated height of 2.02 mm, this microcontroller allows for thinner and more compact device designs, ideal for space-constrained applications.

Width: 27 mm

The 27 mm width of this microcontroller makes it suitable for various PCB sizes and ensures compatibility with standard board layouts, simplifying system integration and design processes.

Peripherals: DMA(128), PWM, TEMPERATURE SENSOR

This microcontroller offers a range of peripherals, including 128 DMA channels, PWM functionality, and a built-in temperature sensor, providing enhanced versatility and supporting various application requirements.

Maximum Clock Frequency: 40 MHz

With a maximum clock frequency of 40 MHz, this microcontroller delivers high-speed processing capabilities, enabling quicker response times and efficient execution of tasks.

Maximum Time At Peak Reflow Temperature (s): 40

The microcontroller's maximum time at peak reflow temperature of 40 seconds ensures proper solder reflow and component attachment during manufacturing processes, contributing to reliable and robust solder joints.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for effective soldering and reworking operations, ensuring secure connections and minimizing the risk of solder joint failures.

Length: 27 mm

With a length of 27 mm, this microcontroller offers a compact form factor, making it suitable for applications where space optimization is essential.

Temperature Grade: AUTOMOTIVE

The microcontroller's automotive temperature grade ensures its reliability and performance in automotive applications, where temperature variations and harsh conditions are common, providing a robust solution for automotive electronics.

Peripheral IC Type: MICROCONTROLLER, RISC

This microcontroller belongs to the RISC architecture, providing high-performance capabilities and efficient execution of instructions, making it suitable for applications requiring fast and responsive operation.

RAM Bytes: 524288

With a generous 524,288 bytes of RAM, this microcontroller offers ample space for data storage and manipulation, supporting complex algorithms and large data processing requirements.

Technology: CMOS

Utilizing CMOS technology, this microcontroller offers low power consumption, high noise immunity, and improved manufacturing yields, making it an energy-efficient and reliable choice for various electronic systems.

Terminal Form: BALL

The ball terminal form of this microcontroller ensures reliable solder connections and easy integration into ball-grid array (BGA) packages, enhancing overall product robustness and compatibility.

PWM Channels: YES

With its included PWM channels, this microcontroller enables precise control of analog output signals, making it suitable for applications such as motor speed control, LED brightness adjustment, and audio modulation.

Connectivity: CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

This microcontroller offers a wide range of connectivity options, including 6 CAN channels, 5 DSPI channels, EBI, Ethernet, and 5 SCI channels, providing flexible communication capabilities for various industrial and networking applications.

ROM Programmability: FLASH

The microcontroller's ROM programmability through flash technology offers flexibility for program updates and modifications, allowing for convenient firmware development and debugging processes.

Terminal Pitch: 1 mm

With a terminal pitch of 1 mm, this microcontroller ensures compatibility with standard PCB design rules and simplifies assembly and soldering processes, making it suitable for mass production and efficient manufacturing.

Moisture Sensitivity Level (MSL): 3

This microcontroller has a moisture sensitivity level of 3, which means it can withstand exposure to moderate levels of moisture during storage and handling, ensuring long-term reliability when properly handled and stored.

Speed: 264 rpm

With a speed capability of 264 revolutions per minute (rpm), this microcontroller is suitable for applications requiring precise motor control and motion sensing.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 bits ensures efficient and optimized storage of program instructions, enabling streamlined execution and reduced memory requirements.

Technical Specifications

Microcontrollers SPC5777CK3MME3R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B416

JESD-609 Code:

e2

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

416

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

RAM Bytes:

524288

ROM Words:

8388608

ROM Programmability:

FLASH

Maximum Seated Height:

2.02 mm

Speed:

264 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

Peripherals:

DMA(128), PWM, TEMPERATURE SENSOR

Trade Compliance

SPC5777CK3MME3R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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