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SPC5777CCK3MMO3R

NXP Semiconductors

SPC5777CCK3MMO3R by NXP Semiconductors

NXP Semiconductors' SPC5777CCK3MMO3R is a 32-bit microcontroller with 8388608 ROM words and 524288 RAM bytes. It features CAN(6), DSPI(5), EBI, ETHERNET, SCI(5) connectivity and peripherals like DMA(128) and PWM. Ideal for automotive applications due to its temperature grade, it operates at a max clock frequency of 40 MHz.

Median Price

$50.941

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$50.941

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10

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Vyrian

USA . 10,802 parts In-Stock

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Digiode

USA . 3,575 parts In-Stock

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Chip Stock

USA . 1,500 parts In-Stock

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Anansix

USA . 319 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,570 parts In-Stock

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$6.000

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AZTECH Wire

Italy . 781 parts In-Stock

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$6.491

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Semicontronic

India . 574 parts In-Stock

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$22.000

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$21.450

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$21.340

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574

$22.000

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Ampacity Inc.

Singapore . 1,116 parts In-Stock

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$29.000

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Aztec Data Supply Inc.

USA . 420 parts In-Stock

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$32.040

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Corohmni

South Africa . 973 parts In-Stock

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$33.488

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Aranea Global

USA . 2,000 parts In-Stock

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$49.922

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$47.925

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Continental Prestige Electronics

USA . 2,581 parts In-Stock

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$51.960

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$51.960

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Vigor

Singapore . 1,053 parts In-Stock

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$75.900

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Microchip USA

USA . 1,665 parts In-Stock

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$107.313

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Argo Parts USA

USA . 4,874 parts In-Stock

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UNI Independent Distributors

Spain . 4,769 parts In-Stock

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Corphita

USA . 4,334 parts In-Stock

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Overview

Experience unparalleled quality and performance with the SPC5777CCK3MMO3R by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers cutting-edge microcontrollers that cater to a wide range of applications. This product offers customers exceptional value, benefits, and advantages, making it the perfect choice for your next project. From automotive to industrial applications, this microcontroller guarantees reliability and efficiency, ensuring optimal performance every time. Trust NXP Semiconductors to provide you with the best-in-class solutions for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount technology enables easy and efficient assembly of the product onto PCBs, saving space and reducing production costs.

Maximum Supply Voltage: 1.32 V

Having a maximum supply voltage of 1.32V ensures compatibility with a wide range of power sources while maintaining efficiency.

Bit Size: 32

The 32-bit architecture provides enhanced processing power and performance for handling complex tasks efficiently.

No. of Terminals: 516

Having a high number of terminals allows for versatile connectivity options and integration with various components and peripherals.

Minimum Operating Temperature: -40 °C

The ability to operate in temperatures as low as -40°C makes the product suitable for use in extreme environmental conditions.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels allows for accurate conversion of analog signals to digital data, essential for many applications.

DMA Channels: YES

Direct Memory Access (DMA) channels enable efficient data transfer between peripherals and memory, improving overall system performance.

ROM Words: 8388608

With a large ROM capacity of 8388608 words, the product can store a significant amount of program data and instructions for high-level applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The use of RISC architecture in the microcontroller's peripheral IC design enhances processing speed and efficiency, ideal for real-time applications.

Technical Specifications

Microcontrollers SPC5777CCK3MMO3R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e2

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

516

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

RAM Bytes:

524288

ROM Words:

8388608

ROM Programmability:

FLASH

Maximum Seated Height:

2.02 mm

Speed:

264 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

Peripherals:

DMA(128), PWM, TEMPERATURE SENSOR

Trade Compliance

SPC5777CCK3MMO3R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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