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MKV31F256VLH12P

NXP Semiconductors

MKV31F256VLH12P by NXP Semiconductors

NXP Semiconductors' MKV31F256VLH12P is a 32-bit microcontroller with 64 terminals, operating at a max clock frequency of 50 MHz. It features ADC and DMA channels, suitable for applications requiring high-speed data processing and control functions. With a low profile flatpack package style, it is ideal for compact electronic devices needing efficient performance.

Median Price

$4.396

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$4.396

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Flip Electronics

USA . 12,500 parts In-Stock

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Vyrian

USA . 1,919 parts In-Stock

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Anansix

USA . 1,131 parts In-Stock

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Bristol Electronics

USA . 1,004 parts In-Stock

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Digiode

USA . 542 parts In-Stock

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Continental Prestige Electronics

USA . 2,468 parts In-Stock

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$4.279

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$4.194

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Argo Parts USA

USA . 945 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$4.484

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$4.484

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AZTECH Wire

Italy . 299 parts In-Stock

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$10.641

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One Stop Electronics

USA . 307 parts In-Stock

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Semicontronic

India . 348 parts In-Stock

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$26.000

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$25.350

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$25.220

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Corohmni

South Africa . 226 parts In-Stock

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$29.546

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Ampacity Inc.

Singapore . 721 parts In-Stock

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$34.000

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Aztec Data Supply Inc.

USA . 2,573 parts In-Stock

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$40.875

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Component Stockers USA

USA . 608 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 16,396 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

Germany . 5,438 parts In-Stock

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Kepictronics

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UNI Independent Distributors

Spain . 4,777 parts In-Stock

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Microchip USA

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Metaverse IC Inc.

Canada . 4,500 parts In-Stock

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Corphita

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Overview

Unleash the power of innovation with the MKV31F256VLH12P by NXP Semiconductors. This top-of-the-line microcontroller offers unparalleled quality and reliability, making it the perfect choice for a wide range of applications. With advanced features such as ADC and DMA channels, PWM channels, and a maximum clock frequency of 50 MHz, this microcontroller provides exceptional performance and flexibility. Experience the value and benefits of NXP Semiconductors' cutting-edge technology with the MKV31F256VLH12P - your solution for all your electronic design needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and labor costs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply options, offering flexibility in system design.

Package Shape: SQUARE

Square package shape is space-efficient and allows for easier PCB layout and routing.

Bit Size: 32

32-bit architecture provides higher processing power and performance capabilities.

No. of Terminals: 64

Higher number of terminals offer more connectivity options for peripherals and external components.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile design with fine pitch terminals enables compact and dense PCB designs.

Minimum Supply Voltage: 1.71 V

Supports low power operation and extends battery life in portable devices.

ADC Channels: YES

Integrated ADC channels allow for analog signal acquisition and processing.

DMA Channels: YES

DMA channels improve data transfer efficiency and reduce CPU load for faster performance.

Terminal Position: QUAD

Quad terminal position enables easy soldering and enhances mechanical stability.

Width: 10 mm

Compact width size allows for smaller form factor PCB designs.

Maximum Clock Frequency: 50 MHz

High clock frequency enables fast data processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 40

Allows for efficient and reliable solder reflow processes during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures solder joints are properly formed for robust connections.

Length: 10 mm

Compact length size complements the width dimension for space-saving PCB layouts.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture provides efficient data processing and reduced power consumption.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and enhances mechanical strength.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

PWM Channels: YES

Integrated PWM channels enable precise control over various actuators and devices.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for dense layout and high connectivity options on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates the level of protection against moisture during storage and handling.

Speed: 120 rpm

High speed capabilities support fast computation and real-time processing tasks.

No. of I/O Lines: 46

Ample I/O lines offer versatile connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MKV31F256VLH12P attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

64

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Speed:

120 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MKV31F256VLH12P Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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