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MKV31F128VLH10P

NXP Semiconductors

MKV31F128VLH10P by NXP Semiconductors

NXP Semiconductors' MKV31F128VLH10P is a 32-bit microcontroller with 122880 ROM words, 24576 RAM bytes, and 2 ADC channels. Ideal for industrial applications, it features a max clock frequency of 50 MHz, peripherals like comparators and timers, and connectivity options such as I2C and SPI interfaces.

Median Price

$4.390

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

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Flip Electronics

USA . 10,000 parts In-Stock

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Vyrian

USA . 4,080 parts In-Stock

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Anansix

USA . 2,717 parts In-Stock

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Digiode

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,150 parts In-Stock

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$4.302

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Argo Parts USA

USA . 3,382 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$4.390

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$4.170

10k+ parts

$4.083

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$4.390

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$4.170

$4.083

Ampacity Inc.

Singapore . 579 parts In-Stock

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$12.000

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One Stop Electronics

USA . 548 parts In-Stock

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$16.000

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AZTECH Wire

Italy . 515 parts In-Stock

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Microchip USA

USA . 912 parts In-Stock

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$33.070

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$33.070

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$33.070

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$33.070

QUARKTWIN TECHNOLOGY LTD

USA . 26,495 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

Germany . 5,796 parts In-Stock

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Corphita

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Authorized Procurement Solutions

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UNI Independent Distributors

Spain . 205 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the MKV31F128VLH10P by NXP Semiconductors. As a trusted manufacturer of high-quality microcontrollers, NXP delivers unmatched performance and reliability. Ideal for a wide range of applications, this product offers customers value like never before. Experience seamless connectivity, precise control, and efficient operation with the MKV31F128VLH10P. Embrace innovation and elevate your projects with this game-changing microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, making the microcontroller suitable for compact designs.

Maximum Supply Voltage: 3.6 V

Supports a maximum supply voltage of 3.6V, enabling compatibility with various power sources.

Package Shape: SQUARE

Square package shape simplifies placement and alignment during assembly processes.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities and performance for applications requiring higher computational power.

DAC Channels: YES

Digital to Analog Convertors facilitate accurate conversion of digital signals to analog outputs, expanding the range of applications the microcontroller can support.

No. of Terminals: 64

Having 64 terminals allows for versatile connectivity options and integration with other components in the system.

Package Style (Meter): FLATPACK

Flatpack style ensures efficient heat dissipation and compact form factor, ideal for space-constrained designs.

Minimum Supply Voltage: 1.71 V

Supports a low minimum supply voltage of 1.71V, enabling operation in energy-efficient applications.

Maximum Operating Temperature: 105 °C

High maximum operating temperature of 105°C allows for reliable performance in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range from -40 to 105°C ensures functionality in both extreme cold and hot conditions.

ADC Channels: YES

Analog to Digital Convertors enable precise conversion of analog signals to digital data, enhancing the microcontroller's sensor interfacing capabilities.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and overall system performance by offloading data transfer tasks from the CPU.

Terminal Position: QUAD

Quad terminal positioning offers easy connectivity and efficient routing of signals on the microcontroller.

ROM Words: 122880

Large ROM size of 122880 words provides ample storage for program instructions and data, accommodating complex algorithms and applications.

Digital To Analog Convertors: 1-Ch 12-Bit

12-bit Digital to Analog Convertor ensures high-resolution and accurate analog output generation for precision applications.

Width: 10 mm

Compact width of 10mm enables space-efficient PCB layout and integration in small electronic devices.

Peripherals: COMPARATOR(2), DMA(4), POR, PWM(12), TIMER(12), WDT

Wide range of peripheral features such as comparators, PWM channels, timers, and watchdog timer enhance the microcontroller's functionality and flexibility in diverse applications.

Maximum Clock Frequency: 50 MHz

High maximum clock frequency of 50MHz enables fast processing speed and responsive operation in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum reflow time of 40 seconds at peak temperature, the microcontroller supports efficient and reliable soldering processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures robust solder joints and withstands lead-free soldering processes.

Length: 10 mm

Compact length of 10mm complements the width parameter for a space-saving design layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature support ensures reliable operation in harsh environmental conditions commonly found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller architecture with RISC processing provides efficient execution of instructions and optimized performance for embedded applications.

RAM Bytes: 24576

Generous RAM size of 24576 bytes allows for efficient data storage and manipulation, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and mechanical reliability during assembly processes.

Analog To Digital Convertors: 2-Ch 16-Bit

16-bit Analog to Digital Convertors provide high-resolution conversion for accurate sensing and data acquisition in analog applications.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

Support for PWM channels enables precise control and modulation of digital signals for applications like motor control, lighting, and power management.

Connectivity: I2C(2), SPI(2), UART(4)

Multiple communication interfaces like I2C, SPI, and UART enhance connectivity options for external devices, sensors, and peripherals.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and flexible firmware updates and customization of the microcontroller's operating software.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables compact layout design and efficient signal routing for high-density applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the microcontroller's resistance to moisture absorption during storage and assembly processes, ensuring product integrity.

Speed: 100 rpm

Operational speed of 100 rpm supports real-time processing tasks and quick response times for time-sensitive applications.

On Chip Program ROM Width: 8

Having an on-chip program ROM width of 8 bits allows for efficient storage and execution of program instructions directly on the microcontroller.

No. of I/O Lines: 46

46 I/O lines offer versatile input-output configurations, enabling the microcontroller to interface with a wide range of external devices and sensors.

Technical Specifications

Microcontrollers MKV31F128VLH10P attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

RAM Bytes:

24576

ROM Words:

122880

ROM Programmability:

FLASH

Speed:

100 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI(2), UART(4)

Peripherals:

COMPARATOR(2), DMA(4), POR, PWM(12), TIMER(12), WDT

Analog To Digital Convertors:

2-Ch 16-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

MKV31F128VLH10P Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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